Semper Technologies (Chiplet Summit)

Chiplet Summit is an annual technical conference dedicated to showcasing the emerging chiplet market and advancing the conversation around chiplet technology. Organized by Semper Technologies, the event aims to unite industry leaders and innovators who are shaping the future of chip design. While the conference itself is held in Santa Clara, California, contact information for the organizing entity, Semper Technologies, lists a P.O. Box in Rancho Santa Fe, California.

The summit serves as a platform for the semiconductor industry, offering keynotes, tutorials, expert tables, and exhibits focused on chiplet-based designs for processors, memories, communications chips, and AI devices. Key areas of discussion include advanced packaging, die-to-die interfaces, AI acceleration, and the broader chiplet ecosystem, providing attendees with solutions for developing chiplets.

The Chiplet Summit has established itself as a significant event in the semiconductor calendar, consistently doubling attendance year-over-year. The 2026 summit, scheduled for February 17-19 at the Santa Clara Convention Center, will emphasize AI acceleration and advanced packaging. It features prominent keynote speakers from leading companies such as Synopsys, Cadence, Siemens EDA, Alphawave Semi, Marvell, the UCIe Consortium, Arm, and the Open Compute Project. Chuck Sobey serves as the General Chair, with Lance Leventhal as the Program Chair, positioning the event as the largest and most focused gathering dedicated to chiplets.