Chiplet Summit Expands Pre-Conference Day with Deep Dives into Emerging Technologies
Event summary
- Chiplet Summit announces pre-conference day on February 17, 2026, ahead of main event (February 17-19).
- Pre-conference features morning tutorials on chiplet basics, HBM interfacing, and advanced packaging.
- Afternoon sessions cover 1,000-chiplet systems, open chiplet economy, and chiplet fusion.
- Superpanel and expert table session included for networking and deep dives.
- Chiplet Summit is the industry’s largest chiplet-focused event, organized by Semper Technologies.
The big picture
The Chiplet Summit’s expanded pre-conference day reflects the growing complexity and specialization within the chiplet ecosystem. As the industry moves toward more integrated and scalable solutions, events like this are crucial for knowledge sharing and collaboration. The focus on emerging topics such as 1,000-chiplet systems and chiplet fusion highlights the strategic shift toward more modular and flexible semiconductor designs.
What we're watching
- Adoption Pace
- How quickly the industry will embrace 1,000-chiplet systems and the open chiplet economy.
- Technical Challenges
- Whether the summit will address critical hurdles in chiplet integration and packaging.
- Industry Collaboration
- The extent to which partnerships like those with UCIe Consortium and Open Compute Project will drive standardization.
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