DB HiTek Targets Europe's Power Market with SiC and GaN Push
- Market Growth: The global SiC power semiconductor market is projected to grow from $4.8 billion in 2026 to $10.4 billion by 2030 (CAGR of 21%). The GaN market is expected to expand from $900 million to $2.9 billion in the same period (CAGR of 33%).
- Customer Engagement: DB HiTek provided SiC and GaN samples to over ten client companies between March and April 2026, with feedback being incorporated into final process verification.
- Event Participation: DB HiTek will showcase its advancements at PCIM Europe 2026, following a successful debut in 2025 where it drew over 1,000 visitors to its booth.
Experts would likely conclude that DB HiTek's strategic focus on SiC and GaN technologies positions it to capitalize on the rapidly growing power semiconductor market, particularly in Europe's automotive and industrial sectors, where demand for high-efficiency power solutions is surging.
DB HiTek Targets Europe's Power Market with SiC and GaN Push
SEOUL, South Korea β April 29, 2026 β South Korean chip foundry DB HiTek is intensifying its campaign to capture a significant share of Europe's burgeoning power semiconductor market, announcing its return to the continent's premier exhibition, PCIM Europe 2026. The move signals a strategic pivot towards next-generation materials, specifically Silicon Carbide (SiC) and Gallium Nitride (GaN), as the company aims to become a critical supplier for the automotive and industrial sectors.
The event, scheduled for June 9-11 in Nuremberg, Germany, will see the 8-inch pure-play foundry showcase its latest advancements in SiC and GaN process technologies. This follows a successful debut at the same event in 2025, where the company engaged with dozens of potential customers and drew over 1,000 visitors to its booth, laying the groundwork for its current expansion efforts.
A Strategic Push into Europe
While DB HiTek is a globally recognized foundry with approximately 400 mass-production customers, its presence in Europe has been more modest compared to other regions. The company's focused participation in PCIM for a second consecutive year underscores a deliberate strategy to change that. Europe, particularly Germany, represents a critical hub for automotive innovation and Industry 4.0, sectors that are increasingly dependent on the high-performance power electronics that SiC and GaN enable.
Building on the momentum from 2025, DB HiTek has already scheduled a robust series of meetings with global clients for the upcoming exhibition. The company stated that it expects last year's discussions to translate into tangible business results, with new and strengthened partnerships solidifying its foothold in the region. Alongside its next-generation offerings, the foundry will also highlight its industry-leading BCDMOS (Bipolar-CMOS-DMOS) technology, a foundational strength in its power management portfolio that provides a stable base for its more advanced ventures.
The SiC and GaN Revolution
At the heart of DB HiTek's strategy are SiC and GaN, two wide-bandgap semiconductor materials poised to redefine power electronics. Unlike traditional silicon, these materials can operate at higher voltages, temperatures, and switching frequencies, resulting in significantly lower power losses, higher efficiency, and more compact device designs. These advantages are not just incremental improvements; they are enabling technologies for the next wave of innovation.
The market potential is enormous, validating the company's strategic investment. According to market research firm Yole DΓ©veloppement, the global SiC power semiconductor market is projected to skyrocket from approximately $4.8 billion in 2026 to $10.4 billion by 2030, a compound annual growth rate (CAGR) of 21%. The GaN market is on an even faster trajectory, expected to expand from $900 million to $2.9 billion in the same period, reflecting a blistering 33% CAGR.
DB HiTek is moving swiftly to capitalize on this trend. The company initiated Multi-Project Wafer (MPW) runs for both SiC and GaN processes in December 2025, providing samples to more than ten client companies between March and April of this year. These customers are now evaluating the sample products, with their feedback being incorporated into final process verification. This collaborative, iterative approach is crucial for tuning the technology ahead of a full-scale commercial launch, which the company has slated for 2027.
Powering the Future of Automotive and Industry
DB HiTek's strategic shift toward industrial and automotive-grade products is a direct response to where the demand for SiC and GaN is most acute. These sectors have stringent requirements for reliability, efficiency, and power density that conventional silicon struggles to meet.
In the automotive world, the transition to electric vehicles (EVs) is the single largest driver. SiC is becoming the material of choice for high-voltage systems like EV traction inverters, especially in advanced 800V architectures. Its ability to handle high power and dissipate heat more effectively translates directly to longer vehicle range, faster charging times, and lighter, more efficient powertrain systems. Meanwhile, GaN is making inroads in on-board chargers (OBCs) and DC-DC converters, where its high-frequency switching capabilities allow for smaller and more efficient components. Analysts forecast that by 2026, over half of all new EVs will utilize either SiC or GaN in their power systems.
Beyond the automotive sector, the industrial landscape is undergoing a similar transformation. SiC and GaN are critical components for renewable energy systems, such as solar and wind power inverters, where maximizing energy conversion efficiency is paramount. They are also enabling the development of more advanced smart grids, industrial motor drives, and automated factory equipment, driving the Industry 4.0 revolution by creating more efficient and reliable systems.
Navigating a Competitive Foundry Landscape
DB HiTek is not entering an empty field. The foundry space for wide-bandgap semiconductors is becoming a competitive arena, with specialists like X-FAB and industry giants like Infineon making significant investments. However, recent market shifts, such as TSMC's planned exit from the GaN segment by 2027, have created openings for dedicated players.
DB HiTek's long-standing expertise as an 8-inch pure-play foundry provides a distinct advantage. Its deep knowledge of power semiconductor manufacturing, exemplified by its established BCDMOS processes and specialized image sensor technologies like SPAD and Global Shutter, creates a strong foundation of trust and technical capability. By leveraging this existing infrastructure and expertise, the company can position itself as a reliable, high-volume manufacturing partner for fabless companies looking to bring SiC and GaN-based products to market.
As the company prepares for PCIM Europe 2026, its message is clear: it is ready to move beyond its traditional strengths and become a key enabler of the high-power future. With customer evaluations underway and a mass production timeline that aligns with the market's explosive growth curve, DB HiTek's strategic push into Europe is a calculated move to power the next generation of technology.