QuickLogic Showcases Chiplet Integration on Intel's 18A Process
Event summary
- QuickLogic will exhibit and present at Chiplet Summit 2026 in Santa Clara, California, from February 17–19.
- The company will deliver a technical session, 'Enabling Flexible Heterogeneous Integration with an eFPGA Chiplet on Intel® 18A,' on February 19.
- The presentation will be led by Trey Peterson, Applications Engineer at QuickLogic.
- QuickLogic is focusing on demonstrating its eFPGA IP and chiplet solutions for advanced heterogeneous integration.
The big picture
QuickLogic's focus on chiplet integration reflects the broader industry trend towards disaggregation of chip design and manufacturing to improve flexibility and address escalating design complexity. The company's partnership with Intel to demonstrate on the 18A process highlights a strategic alignment with a major foundry, but also introduces potential risks associated with reliance on a single manufacturing partner. This move positions QuickLogic to capitalize on the growing demand for heterogeneous integration solutions, but success hinges on demonstrating clear value and securing design wins.
What we're watching
- Process Node
- The demonstration on Intel's 18A process signals QuickLogic's ambition to target leading-edge manufacturing, which will be critical for performance and power efficiency but also introduces dependencies on Intel's roadmap and yields.
- Adoption Rate
- The pace at which QuickLogic's eFPGA chiplet solutions are adopted by other chip designers will determine its ability to scale revenue beyond niche applications like aerospace and defense.
- Competitive Landscape
- How QuickLogic differentiates its eFPGA IP and chiplet offerings against larger competitors with broader process technology portfolios will be a key factor in securing design wins.
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