QuickLogic Corporation

QuickLogic Corporation is a fabless semiconductor company headquartered in San Jose, California, specializing in innovative embedded FPGA (eFPGA) intellectual property (IP), discrete FPGAs, and FPGA System-on-Chips (SoCs). The company's mission is to be a trusted partner for the Critical Infrastructure Sector, delivering purpose-built eFPGA IP, specialized FPGA devices, and user tools that address critical security, reliability, and operational demands in extreme environments, while ensuring long-term supply assurance. QuickLogic also aims to serve underserved markets and empower innovators through open-source technology.

QuickLogic's product portfolio includes eFPGA IP (such as Rad-Hard eFPGA IP), discrete FPGAs (including Antifuse FPGAs and FPGA MCUs), and FPGA SoCs. Through its subsidiary, SensiML Corporation, QuickLogic also offers AI/ML software solutions for edge and endpoint AI applications. These technologies are deployed across various market segments, including industrial, aerospace and defense, consumer electronics, computing, mobile, wearables, and IoT devices, with a focus on ultra-low power solutions.

Led by President and CEO Brian C. Faith, QuickLogic has recently been active in securing strategic contracts and financial agreements. In April 2026, the company established a new banking relationship and secured a $10 million revolving credit facility. Earlier in 2026, QuickLogic announced a $13 million contract award for its Strategic Radiation Hardened Program, aimed at meeting Department of War strategic and space system requirements, and a contract for high-density eFPGA Hard IP optimized for Intel 18A technology. The company reported its fiscal fourth-quarter and full-year 2025 financial results in March 2026, highlighting an expanded U.S. SRH FPGA prime contract ceiling near $89 million.

Latest updates

QuickLogic Secures $10 Million Credit Facility, Shifts Banking Partner

Event summary

  • QuickLogic has secured a $10 million revolving credit facility from Sunflower Bank, replacing a previous agreement with Heritage Bank of Commerce.
  • The new credit facility is a three-year senior secured agreement, maturing on April 24, 2029.
  • The credit line will be used for general corporate purposes, including working capital.
  • QuickLogic intends to use the facility to support initiatives including radiation-hardened FPGA development, eFPGA Hard IP licensing, and its Storefront business.

The big picture

The new credit facility provides QuickLogic with a much-needed boost in financial flexibility, particularly as it pursues contracts with the US Government and expands its licensing program. The shift from Heritage Bank of Commerce to Sunflower Bank may indicate a reassessment of banking relationships or a desire for more favorable terms. While the $10 million facility is relatively modest in the context of the broader semiconductor industry, it represents a significant lifeline for a smaller, specialized player like QuickLogic.

What we're watching

Financial Health
The shift in banking partners and the size of the credit facility suggest QuickLogic is actively managing its financial resources, and the terms of the new agreement will be key to assessing its long-term stability.
Government Contracts
The stated intention to use the credit line for radiation-hardened FPGA development for the US Government indicates a reliance on government contracts, and the success of these bids will be a significant driver of revenue.
Licensing Expansion
QuickLogic’s plans to expand eFPGA Hard IP licensing across more process technologies will determine the scalability of its revenue model and its ability to compete with larger FPGA vendors.

QuickLogic Expands Sales Reach with Chiplet-Focused Representative

Event summary

  • QuickLogic appointed Quantum Leap Solutions as an authorized sales representative, effective April 16, 2026.
  • Quantum Leap Solutions will focus on QuickLogic’s ASIC, IP, and chiplet offerings.
  • Quantum Leap Solutions specializes in semiconductor IP integration and chiplet architectures.
  • QuickLogic's VP of IP Sales, Andy Jaros, highlighted Quantum Leap's experience with ASIC and chiplet design.
  • Quantum Leap Solutions' CEO, Mike Ingster, cited increasing customer demand for embedded FPGA for post-silicon flexibility.

The big picture

QuickLogic’s move to leverage Quantum Leap Solutions signals a strategic push to expand its reach within the burgeoning chiplet market. This partnership addresses the growing complexity of silicon design and the increasing demand for customizable solutions, particularly as application requirements evolve post-silicon. The move suggests QuickLogic is prioritizing design services and customer engagement to complement its core IP and FPGA offerings.

What we're watching

Sales Execution
The effectiveness of this partnership will depend on Quantum Leap Solutions’ ability to penetrate new markets and accelerate QuickLogic’s customer adoption, particularly given the complexity of chiplet integration.
Market Adoption
Whether the increased demand for embedded FPGA, as cited by Quantum Leap Solutions, translates into substantial revenue growth for QuickLogic remains to be seen, given the relatively niche nature of the technology.
Competitive Landscape
The partnership’s impact on QuickLogic’s competitive positioning against larger FPGA vendors will be influenced by Quantum Leap Solutions’ existing relationships and potential conflicts of interest.

QuickLogic Advances Radiation-Hardened FPGA Push with Dev Kit Release

Event summary

  • QuickLogic released a development kit for its RadPro FPGA, fabricated in the U.S. on GlobalFoundries’ 12nm process.
  • The RadPro FPGA is designed to meet requirements for defense industrial base (DIB) programs.
  • QuickLogic began accepting orders for the RadPro Dev Kit in Q1 2026, with shipments scheduled after the HEART Conference (April 13–17, 2026).
  • The RadPro FPGA is silicon-proven, marking a milestone in QuickLogic's radiation-hardened FPGA initiative.

The big picture

QuickLogic's RadPro FPGA addresses a growing need for domestically sourced, radiation-hardened semiconductors within the U.S. defense industrial base, spurred by supply chain concerns and government mandates. The company’s focus on radiation hardening, combined with its eFPGA capabilities, positions it to capture a niche market segment within the broader semiconductor industry. Success hinges on securing and executing on DIB contracts, which are often subject to lengthy procurement processes and stringent performance requirements.

What we're watching

Order Fulfillment
The timing and volume of RadPro Dev Kit shipments following the HEART Conference will indicate initial DIB interest and potential for broader adoption.
Program Integration
The ability of QuickLogic to transition DIB evaluations into formal 'programs of record' will be crucial for long-term revenue generation and validates the strategic focus.
Competitive Landscape
How QuickLogic’s U.S.-fabricated, radiation-hardened FPGA offering differentiates from competitors in the DIB space will determine its market share and pricing power.

QuickLogic Secures Contract for eFPGA IP on Intel's 18A Process

Event summary

  • QuickLogic has secured a mid-6-figure contract to implement architectural enhancements for its eFPGA Hard IP.
  • The contract involves integration with a customer's ASIC based on Intel's 18A fabrication technology.
  • The enhancements focus on improving power consumption, performance, and silicon area utilization (PPA).
  • These improvements, initially developed in 2025, are extensible to other advanced fabrication nodes.
  • QuickLogic's VP of IP Sales, Andy Jaros, highlighted the company's ability to address high-density eFPGA core requirements.

The big picture

This contract signals QuickLogic's continued focus on high-density eFPGA solutions and its strategic alignment with Intel's advanced fabrication roadmap. The mid-6-figure deal size, while not transformative, validates QuickLogic’s IP and positions it to capitalize on the growing demand for flexible, customizable silicon architectures within ASICs and SoCs. The extensibility of these enhancements across fabrication nodes suggests a potential for recurring revenue and broader market penetration.

What we're watching

Fabrication Adoption
The success of QuickLogic’s IP on Intel’s 18A process will be a key indicator of the broader adoption rate for this fabrication node among ASIC and SoC developers.
Competitive Landscape
Whether QuickLogic can maintain its competitive advantage in eFPGA Hard IP, particularly against larger players with broader fabrication partnerships, remains to be seen.
Cost Sensitivity
The stated ability to address cost-sensitive applications will be tested as broader economic conditions impact demand for custom silicon solutions.

QuickLogic Showcases Chiplet Integration on Intel's 18A at GOMACTech

Event summary

  • QuickLogic will exhibit at the GOMACTech Conference 2026 in New Orleans from March 9-12, 2026.
  • The company will present a technical poster on enabling heterogeneous integration using an eFPGA chiplet on Intel’s 18A process.
  • Trey Peterson, Field Applications Engineer, will present the poster on March 12, 2026.
  • QuickLogic specializes in eFPGA IP, ruggedized FPGAs, and chiplet solutions, targeting aerospace, defense, industrial, computing, and consumer markets.

The big picture

QuickLogic's participation in GOMACTech and its focus on chiplet integration with Intel’s 18A process highlights the increasing trend towards heterogeneous integration and modular chip design within the semiconductor industry. This strategy aims to address the growing complexity of chip design and the need for flexible, adaptable solutions across diverse markets. The success of this approach will depend on QuickLogic's ability to navigate the complexities of advanced manufacturing and establish a strong position within the emerging chiplet ecosystem.

What we're watching

Process Node Adoption
The demonstration on Intel’s 18A process signals QuickLogic’s intent to capitalize on advanced manufacturing nodes, but success hinges on Intel’s ability to reliably deliver that technology at scale.
Chiplet Ecosystem
QuickLogic’s focus on chiplet integration underscores the growing importance of modular chip design, and its ability to secure partnerships and design flows will be crucial for broader adoption.
Competitive Landscape
The presentation will provide insight into QuickLogic's differentiation strategy within the eFPGA market, and whether its approach can gain traction against larger, more established players.

QuickLogic Secures $89M Government Contract Amidst Revenue Decline

Event summary

  • QuickLogic received a $13 million tranche of an expanded U.S. Strategic Radiation Hardened (SRH) FPGA government program, bringing the total contract ceiling to approximately $89 million.
  • The company taped out a test chip on GlobalFoundries’ 12LP process as part of the SRH FPGA program.
  • Fiscal Q4 2025 revenue decreased by 34.2% year-over-year to $3.7 million, while new product revenue decreased by 38.5% to $2.8 million.
  • QuickLogic incorporated architectural enhancements from a feasibility study into its FPGA designs, targeting high-density markets.

The big picture

QuickLogic's performance highlights the challenges facing smaller fabless semiconductor companies navigating a complex macroeconomic environment. While the government contracts provide a near-term revenue stream, the declining revenue and compressed margins underscore the need for broader commercial adoption of its eFPGA technology. The partnership with Idaho Scientific signals an attempt to diversify into the hardware cybersecurity space, a market experiencing rapid growth but also intense competition.

What we're watching

Government Dependence
The company's reliance on government contracts, particularly the SRH program, creates a concentration risk; future revenue will be heavily influenced by continued contract awards and potential shifts in government spending priorities.
Gross Margin Recovery
The significant decline in gross margin requires close monitoring; QuickLogic must demonstrate a path to profitability through cost controls, pricing strategies, or a shift towards higher-margin products.
Commercial Adoption
While design wins are positive, the pace at which these translate into production revenue will be critical; the company needs to prove its eFPGA solutions can compete effectively in commercial markets.

QuickLogic Secures $13M Contract Extension for Radiation-Hardened FPGA Development

Event summary

  • QuickLogic received a $13 million contract award to continue development of Strategic Radiation Hardened (SRH) FPGA technology.
  • The contract is part of a multi-year program initiated in August 2022.
  • QuickLogic serves as the Prime Contractor for the program, supporting U.S. Department of War strategic and space system requirements.
  • The funding will support continued development and demonstration of the SRH FPGA technology.

The big picture

This contract extension underscores the growing demand for specialized semiconductor solutions within the aerospace and defense sector, particularly those designed to withstand harsh radiation environments for space-based applications. While the $13 million award represents a relatively small portion of QuickLogic’s overall revenue, it highlights the company’s strategic focus on high-margin, niche markets and its ability to secure significant government contracts. The program's longevity suggests a sustained need for QuickLogic’s specialized FPGA technology within the Department of War’s systems.

What we're watching

Program Scope
The long-term value of this contract hinges on the Department of War's continued adoption of QuickLogic's SRH technology and the potential for follow-on orders beyond the initial multi-year commitment.
Competitive Landscape
Increased competition within the radiation-hardened FPGA market could pressure QuickLogic's pricing and margins, necessitating ongoing innovation to maintain its position as a prime contractor.
Technical Risk
The success of the SRH program depends on QuickLogic's ability to meet the stringent reliability and performance requirements of the Department of War, which carries inherent technical and execution risks.

QuickLogic Showcases Chiplet Integration on Intel's 18A Process

Event summary

  • QuickLogic will exhibit and present at Chiplet Summit 2026 in Santa Clara, California, from February 17–19.
  • The company will deliver a technical session, 'Enabling Flexible Heterogeneous Integration with an eFPGA Chiplet on Intel® 18A,' on February 19.
  • The presentation will be led by Trey Peterson, Applications Engineer at QuickLogic.
  • QuickLogic is focusing on demonstrating its eFPGA IP and chiplet solutions for advanced heterogeneous integration.

The big picture

QuickLogic's focus on chiplet integration reflects the broader industry trend towards disaggregation of chip design and manufacturing to improve flexibility and address escalating design complexity. The company's partnership with Intel to demonstrate on the 18A process highlights a strategic alignment with a major foundry, but also introduces potential risks associated with reliance on a single manufacturing partner. This move positions QuickLogic to capitalize on the growing demand for heterogeneous integration solutions, but success hinges on demonstrating clear value and securing design wins.

What we're watching

Process Node
The demonstration on Intel's 18A process signals QuickLogic's ambition to target leading-edge manufacturing, which will be critical for performance and power efficiency but also introduces dependencies on Intel's roadmap and yields.
Adoption Rate
The pace at which QuickLogic's eFPGA chiplet solutions are adopted by other chip designers will determine its ability to scale revenue beyond niche applications like aerospace and defense.
Competitive Landscape
How QuickLogic differentiates its eFPGA IP and chiplet offerings against larger competitors with broader process technology portfolios will be a key factor in securing design wins.
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