QuickLogic Showcases Chiplet Integration on Intel's 18A at GOMACTech
Event summary
- QuickLogic will exhibit at the GOMACTech Conference 2026 in New Orleans from March 9-12, 2026.
- The company will present a technical poster on enabling heterogeneous integration using an eFPGA chiplet on Intel’s 18A process.
- Trey Peterson, Field Applications Engineer, will present the poster on March 12, 2026.
- QuickLogic specializes in eFPGA IP, ruggedized FPGAs, and chiplet solutions, targeting aerospace, defense, industrial, computing, and consumer markets.
The big picture
QuickLogic's participation in GOMACTech and its focus on chiplet integration with Intel’s 18A process highlights the increasing trend towards heterogeneous integration and modular chip design within the semiconductor industry. This strategy aims to address the growing complexity of chip design and the need for flexible, adaptable solutions across diverse markets. The success of this approach will depend on QuickLogic's ability to navigate the complexities of advanced manufacturing and establish a strong position within the emerging chiplet ecosystem.
What we're watching
- Process Node Adoption
- The demonstration on Intel’s 18A process signals QuickLogic’s intent to capitalize on advanced manufacturing nodes, but success hinges on Intel’s ability to reliably deliver that technology at scale.
- Chiplet Ecosystem
- QuickLogic’s focus on chiplet integration underscores the growing importance of modular chip design, and its ability to secure partnerships and design flows will be crucial for broader adoption.
- Competitive Landscape
- The presentation will provide insight into QuickLogic's differentiation strategy within the eFPGA market, and whether its approach can gain traction against larger, more established players.
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