QuickLogic Secures $2.7M FPGA Hard IP Contract with GlobalFoundries
Event summary
- QuickLogic wins $2.7M contract for discrete FPGA design and tape-out, with revenue recognition from Q2 2026 to Q1 2027.
- FPGA test chips will be integrated into a new evaluation kit compatible with third-party development environments for defense and commercial customers.
- Tape-out scheduled for 2026 using GlobalFoundries' 12LP fabrication process.
- QuickLogic exploring chiplet-based offerings to pair FPGAs with third-party microcontrollers.
The big picture
This contract underscores QuickLogic's push into discrete FPGA solutions, complementing its embedded FPGA offerings. The move aligns with broader industry trends toward modular, chiplet-based architectures, particularly in defense and industrial applications. The $2.7M deal, while not transformative in scale, signals QuickLogic's ability to secure high-value contracts in niche semiconductor segments.
What we're watching
- Execution Risk
- Whether QuickLogic can deliver the FPGA test chips and evaluation kit on schedule by late 2026.
- Market Expansion
- The pace at which QuickLogic can convert interest from partners into actual chiplet-based offerings.
- Revenue Growth
- How the $2.7M contract will impact QuickLogic's financial performance over the next year.
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