Jeonbuk National University Advances EMI Shielding Materials with Novel Composite Fabrication
Event summary
- Researchers at Jeonbuk National University developed a new fabrication method for segregated conductive polymer composites (S-CPCs) using polypropylene and a lower-melting terpolymer.
- The team achieved up to 124.07% increase in electrical conductivity and 68.11% in thermal conductivity for graphitic nanoplatelet-based composites (G-SCs).
- Hexagonal boron nitride-based composites (B-SCs) saw a 53.54% improvement in thermal conductivity.
- The study was published in Advanced Composites and Hybrid Materials on December 2, 2025.
The big picture
As portable and wearable electronics become more sophisticated, the demand for materials that can manage both electromagnetic interference and heat dissipation grows. This research addresses a critical gap in the development of segregated conductive polymer composites, offering a potential solution for next-generation electronic systems. The breakthrough could position Jeonbuk National University as a key player in advanced materials research.
What we're watching
- Commercialization Potential
- How quickly these materials can transition from lab to commercial applications in EMI shielding and thermal management.
- Model Accuracy
- Whether the new segregated percolation models will be widely adopted for designing advanced materials.
- Industry Adoption
- The pace at which electronics manufacturers will integrate these composites into next-generation devices.
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