ChipMOS to Outline Growth Strategy at BofA Asia Tech Conference

  • ChipMOS will present at BofA Securities 2026 Asia Tech Conference on March 18-19 in Taipei.
  • Senior VP Jesse Huang will discuss financial results, business trends, and growth opportunities.
  • Investor presentation available on ChipMOS's IR website.
  • Company operates semiconductor assembly and test facilities in Taiwan.

ChipMOS's participation in the BofA conference comes amid heightened focus on semiconductor supply chains and outsourced manufacturing services. The company's presentation will be closely watched as investors assess its ability to navigate macroeconomic challenges and maintain its position in a sector facing potential tariff impacts. With facilities in key Taiwanese tech hubs, ChipMOS serves as a critical link in the global semiconductor value chain.

Market Positioning
How ChipMOS will differentiate itself in the competitive OSAT sector.
Geopolitical Risks
Whether trade regulations and tariffs will impact ChipMOS's operations.
Financial Performance
The pace at which ChipMOS can deliver on its growth projections.