ChipMOS TECHNOLOGIES INC.

ChipMOS TECHNOLOGIES INC. is a Taiwan-based company primarily engaged in the outsourced semiconductor assembly and test (OSAT) services industry. Established in 1997, its core business involves integrated circuits (IC) packaging and testing. The company is headquartered in Hsinchu, Taiwan, with significant operations in the Hsinchu Science Park. Its mission is to continuously develop and deliver high-quality products and services, fostering strong customer relationships while expanding its presence in the global semiconductor market.

ChipMOS offers a comprehensive suite of back-end solutions, including wafer bumping, wafer-level chip-size packaging, multi-chip packaging, and various leadframe-based and organic substrate-based package assembly services such as TSOP, BGA, and COF. The company provides extensive testing services, including engineering test, wafer probing, and final test for high-density memory, mixed-signal, and liquid crystal display (LCD) driver semiconductors. These products and services cater to diverse market segments, including automotive, information technology, communications, mobile devices, wearables, consumer electronics, personal computers, and emerging applications like drones, Virtual Reality, and Assisted Reality.

As a leading independent provider of total semiconductor testing and packaging solutions, ChipMOS TECHNOLOGIES INC. holds a prominent position as one of the world's largest semiconductor services companies and a leader in Taiwan's IC packaging and testing sector, particularly noted for its substantial capacity in LCD driver semiconductor packaging and testing. The company has recently reported strong financial performance, including significant year-over-year revenue increases in early 2026. In April 2026, ChipMOS agreed to acquire building and facilities in Tainan from INNOLUX Corporation for TWD 880 million, demonstrating ongoing strategic expansion.