Ceva and Actions Technology Launch Bluetooth HDT Audio Chips — Ceva, Inc.

Event summary

Ceva and Actions Technology introduced the ATS296X-series Bluetooth audio chips, powered by Ceva's Bluetooth High Data Throughput (HDT) platform on August 4, 2026.
The collaboration has delivered over 100 million wireless audio SoCs previously.
Bluetooth HDT technology increases peak throughput from 2 Mbps to approximately 7.5 Mbps, enabling lossless multi-channel audio and ultra-low latency gaming audio.
The ATS296X-series is undergoing interoperability testing to ensure broad ecosystem compatibility.

The big picture

This collaboration marks one of the earliest commercial implementations of Bluetooth HDT technology, a key feature of the upcoming Bluetooth 7.0 specification. The partnership leverages Ceva's extensive experience in wireless connectivity and Actions Technology's expertise in smart wireless audio SoCs, positioning them at the forefront of the next generation of high-performance wireless audio products. The shift towards Physical AI and the increasing demand for richer wireless experiences underscore the strategic significance of this development.

What we're watching

Market Adoption: The pace at which Bluetooth HDT technology will be adopted by downstream customers and integrated into premium wireless audio products.
Competitive Positioning: Whether Ceva and Actions Technology can maintain their competitive edge as other leading Bluetooth chipset providers enter the market with similar offerings.
Technological Validation: The outcome of interoperability testing for the ATS296X-series, which will determine the broader ecosystem compatibility and commercial success of the chips.