Ceva, Inc.

Ceva, Inc. is a publicly traded semiconductor and software intellectual property (IP) company headquartered in Rockville, Maryland, United States. Established in November 2002 through the merger of the DSP IP licensing division of DSP Group and Parthus Technologies plc, Ceva specializes in licensing signal processing platforms and AI processors.

The company's core offerings include a comprehensive portfolio of wireless connectivity IPs, such as Bluetooth, Wi-Fi, Ultra-Wideband (UWB), and 5G, alongside scalable Edge AI Neural Processing Unit (NPU) IPs like the NeuPro family, and advanced sensor fusion solutions. Ceva licenses these technologies to semiconductor companies and Original Equipment Manufacturers (OEMs) globally, enabling the creation of power-efficient, intelligent, and connected devices for diverse markets including automotive, consumer IoT, industrial, infrastructure, mobile, and personal computing. To date, over 20 billion Ceva-powered chips have been shipped worldwide.

Amir Panush has served as the Chief Executive Officer since January 2023. Recent developments include the launch of next-generation UWB IP with extended range and higher throughput in March 2026, and the Ceva-NeuPro-Nano NPU winning an Artificial Intelligence Award at embedded world 2026. Ceva reported record fourth-quarter revenue of $31.3 million and full-year revenue of $109.6 million for 2025, with AI licensing emerging as a significant growth area, contributing over 20% of annual licensing revenue. The company also announced strategic collaborations with major players like Renesas Electronics Corporation and Microchip Technology.