ASUS Launches Liquid-Cooling Solutions for AI Data Centers, Partners with Schneider and Vertiv
Event summary
- ASUS unveiled optimized liquid-cooling solutions for next-generation AI and HPC data centers on February 26, 2026.
- The solutions include direct-to-chip (D2C), in-row CDU-based cooling, and hybrid configurations, developed with partners like Schneider and Vertiv.
- ASUS deployed Taiwan's first fully liquid-cooled AI supercomputer for the National Center for High-performance Computing, achieving a PUE of 1.18.
- ASUS will showcase its liquid-cooling ecosystem at NVIDIA GTC 2026 as a Diamond Sponsor.
The big picture
ASUS's liquid-cooling solutions address the growing thermal and power demands of AI and HPC workloads, which are outpacing traditional air-cooling methods. The strategic partnerships with global infrastructure leaders underscore the critical need for scalable, energy-efficient cooling solutions in the rapidly evolving data center landscape. The deployment of Taiwan's first fully liquid-cooled AI supercomputer highlights ASUS's capability to integrate high performance with sustainable design, positioning the company as a key player in the next generation of AI infrastructure.
What we're watching
- Market Adoption
- The pace at which ASUS's liquid-cooling solutions gain traction in AI and HPC data centers, particularly among global infrastructure leaders.
- Competitive Positioning
- Whether ASUS can sustain its leadership in compute density and AI performance against competitors in the thermal management space.
- Strategic Partnerships
- How ASUS's collaborations with Schneider, Vertiv, and other partners will evolve to address escalating thermal and power challenges in next-generation data centers.
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