Soitec and ZenSemi Forge Alliance to Power Next-Gen AI, EVs, and Robotics

BERNIN, France – June 29, 2026 – In a significant move to address the voracious power demands of next-generation technologies, French semiconductor materials leader Soitec and Chinese specialty foundry ZenSemi have announced a strategic collaboration. The partnership is set to enable high-volume production of advanced 300mm power electronics, positioning the duo to become a critical supplier for the booming AI datacenter, electric vehicle (EV), and robotics markets.

The collaboration will see Soitec supply its cutting-edge 300mm Power-SOI (Silicon-on-Insulator) substrates to ZenSemi, which will in turn develop and ramp up a new BCD-on-SOI (Bipolar-CMOS-DMOS on SOI) manufacturing process. This synergy combines Soitec's deep expertise in engineered substrates with ZenSemi’s specialized foundry capabilities, creating a high-performance platform for chip designers worldwide. The move signals a maturing of the advanced power semiconductor ecosystem in China and aims to provide a robust solution for the complex power management challenges facing today's most innovative industries.

“This partnership underscores the maturity of the BCD-on-SOI ecosystem in China,” said René Jonker, Chief Product Officer at Soitec. “By leveraging ZenSemi’s specialized foundry services, led by a team with a proven track record in international power electronics standards, and Soitec’s recognized engineered substrate quality, we are creating a new benchmark for power electronics.”

The Technological Edge: Why BCD-on-SOI Matters

At the heart of this partnership lies a technology that, while highly technical, offers tangible benefits: BCD-on-SOI. Unlike traditional chip manufacturing on bulk silicon, Silicon-on-Insulator technology inserts a thin layer of insulating oxide beneath the active silicon layer. This seemingly simple addition has profound implications for performance and reliability.

This "full dielectric isolation" inherently eliminates parasitic latch-up, a notorious failure mechanism in conventional chips where unintended electrical paths can cause a device to malfunction or self-destruct. It also drastically reduces electrical "crosstalk" between different parts of the chip. This allows engineers to densely integrate high-voltage power components and sensitive, low-voltage control circuits onto a single piece of silicon without them interfering with one another—a feat that is challenging and inefficient with older technologies.

The real-world impact is significant. ZenSemi has already reported a striking ~30% die size reduction for an 18-channel analog front-end (AFE) device in its first silicon validation using the SOI process, compared to traditional bulk BCD methods. A smaller die size directly translates to lower manufacturing costs, as more chips can be produced from a single 300mm wafer. It also enables greater power density, allowing for smaller, more efficient, and more powerful components in space-constrained applications like EV battery management systems and humanoid robot joints.

“For an 18-channel analog front-end (AFE) device, our SOI-based implementation achieves a striking ~30% die size reduction versus traditional bulk BCD processes," stated Ruby Yan, Vice President of Sales & Marketing at ZenSemi. "This outcome powerfully validates SOI’s unmatched strengths in die area miniaturization and circuit resilience."

Fueling the High-Growth Engines of Tomorrow

The Soitec-ZenSemi collaboration is strategically timed to capitalize on explosive growth in sectors where power efficiency and reliability are paramount. The global market for power management ICs (PMICs) is already valued at over $33 billion and is projected by industry analysts to exceed $55 billion by 2034, driven by the very applications this partnership targets.

AI datacenters, for instance, are grappling with monumental energy consumption. As AI models become more complex, the need for high-efficiency power distribution to processors and memory becomes a critical bottleneck. BCD-on-SOI technology offers a path to more efficient and compact power delivery systems, helping to manage the immense operational costs and thermal challenges of these facilities.

Similarly, the automotive industry's rapid transition to electric vehicles has created unprecedented demand for advanced power semiconductors. The semiconductor content in EVs is already significantly higher than in traditional cars, with projections showing it could reach $2,000 per vehicle by 2030. These chips are essential for battery management systems (BMS), onboard chargers, and powertrain inverters—all areas where the enhanced reliability and functional safety (FuSa) capabilities of BCD-on-SOI are highly valued.

Beyond datacenters and cars, emerging fields like humanoid robotics demand compact, efficient, and robust power solutions to enable complex movements and long operational times. The global semiconductor market for robotics is forecast to more than triple by 2030, and technologies that can deliver high performance in a small, lightweight package will be essential.

A Strategic Play in a Shifting Global Landscape

This partnership is not just a technical milestone; it is a noteworthy strategic maneuver within the complex geopolitics of the global semiconductor industry. As nations and corporations navigate ongoing trade tensions and a push for supply chain resilience, the collaboration between a European materials giant and a Chinese specialty foundry highlights a path of continued international cooperation.

For China, which has made semiconductor self-sufficiency a national priority, this alliance is a significant step. It enables ZenSemi, a domestic foundry, to scale up production on an advanced 300mm platform, a key indicator of manufacturing prowess. This enhances the country's capability to produce critical power ICs for its own burgeoning EV and tech industries, potentially reducing reliance on foreign foundries for certain applications.

While the competitive landscape for BCD technology includes established Western players like STMicroelectronics and Infineon, this partnership strengthens China's position in the value chain. It creates a new, high-volume manufacturing source in Asia, which could help diversify global supply and offer chip design firms—both in China and worldwide—a new option for their manufacturing needs.

"Through our collaboration with Soitec, we will rapidly ramp our 300mm SOI-BCD manufacturing capacity," Yan explained. "We will empower both domestic Chinese design houses and worldwide clients to build smaller, more robust, cost-optimized power ICs catering to fast-expanding automotive, artificial intelligence, and industrial markets.”

The Foundation of Innovation: Materials and Manufacturing

While end products like EVs and AI accelerators capture headlines, this partnership shines a light on the foundational layers of innovation: advanced materials and specialized manufacturing. The relentless progress of the tech industry depends on breakthroughs in material science, embodied by companies like Soitec. Its Power-SOI substrates are not mere commodities but highly engineered products that enable the performance leap seen in BCD-on-SOI technology.

Likewise, the role of specialty foundries like ZenSemi is becoming increasingly crucial. Rather than competing in the cutthroat market for leading-edge logic chips, these foundries focus on specific, high-value processes like MEMS, embedded memory, and advanced power electronics. Their flexible, customer-centric approach provides the tailored manufacturing needed for a diverse range of applications that standard, high-volume foundries may not service as effectively.

By combining Soitec’s material leadership with ZenSemi's focused manufacturing, the partnership is building more than just a production line; it is strengthening the entire ecosystem for next-generation power electronics. This foundational work provides the tools that chip designers need to innovate, ultimately enabling the strategic shifts and business growth that define our rapidly changing world.