NEPCON JAPAN at 40: Tokyo Expo Unites AI, Auto & Global Tech Giants

TOKYO, JAPAN – January 16, 2026 – As the global technology landscape navigates profound shifts in artificial intelligence, supply chain dynamics, and industrial integration, Tokyo is set to become the epicenter of the electronics world. Next week, from January 21-23, the 40th edition of NEPCON JAPAN will open its doors at Tokyo Big Sight, marking a significant milestone for one of Asia's most influential technology trade shows.

Organized by RX Japan, this anniversary event is poised to be its largest yet. It will run alongside three other major exhibitions—AUTOMOTIVE WORLD, Factory Innovation Week, and Smart Logistics Expo—creating a comprehensive super-showcase. The combined events are expected to draw an estimated 92,000 visitors and feature 1,850 exhibitors, transforming the entire Tokyo Big Sight venue into a sprawling campus dedicated to the future of technology.

A Four-Decade Legacy of Electronic Evolution

Founded in 1987, NEPCON JAPAN has grown in lockstep with the nation's electronics industry, charting a course from the era of printed circuit boards to today's complex world of advanced semiconductors and smart systems. For 40 years, it has served as a critical barometer for technological progress, reflecting Japan's pivotal role in global manufacturing and innovation.

The event's trajectory mirrors the industry's own evolution. What began as a focused exhibition on electronics manufacturing has expanded to encompass seven specialized sub-shows, covering everything from testing technologies and IC packaging to power devices. This growth is reflected in its attendance, which has shown consistent momentum, climbing from 77,744 attendees in 2024 to an anticipated 92,000 for this landmark edition. More than just a trade show, NEPCON JAPAN has cemented its reputation as an essential gateway for international businesses looking to penetrate the dynamic Japanese and broader Asian electronics markets, fostering decades of collaboration and innovation.

"The 40th year of NEPCON JAPAN will be a grand celebration of the global electronics industry that it has grown alongside," said Masaki Soda, the event's Show Director. "With over 1,850 exhibitors from all over the world, the three-day event will serve as a massive showcase of R&D, manufacturing, and packaging technologies, alongside its co-located shows."

The Epicenter of Next-Generation Semiconductor Strategy

This year's edition places a heavy emphasis on the technologies poised to define the next decade, particularly in semiconductors and artificial intelligence. The technical seminar program, featuring over 200 sessions, reads like a who's who of the global semiconductor ecosystem. Industry giants are converging to share roadmaps and debate the future of chip technology.

Key sessions will spotlight the critical role of advanced packaging—the science of integrating multiple chips into a single, powerful device. Tarek Ibrahim of Intel Foundry is slated to discuss the company's pioneering work in "Glass Core Substrate Advanced Packaging," a technology promising higher performance and efficiency. Similarly, Ryutaro Yasuhara from TSMC Japan's 3DIC R&D Center will delve into how "3DIC Technologies" are essential to "Unleash AI Innovation." Scott Chen, a senior vice president at Advanced Semiconductor Engineering, Inc. (ASE), a leader in chip assembly and testing, will address how to scale AI performance through packaging and power efficiency.

Further highlighting Japan's resurgent ambitions in the chip sector, a representative from Rapidus Corp., the government-backed foundry, will present on the future of semiconductors in the AI era, focusing on chiplet technology. This focus underscores a national strategy to reclaim a leading position in advanced logic chip manufacturing. The event will also feature a new "Generative AI World" zone, dedicated to showcasing practical AI solutions for the electronics industry, moving the conversation from abstract concepts to tangible applications.

A Convergence of Interconnected Industries

Perhaps the most significant aspect of the 40th-anniversary event is its full integration with AUTOMOTIVE WORLD, Factory Innovation Week, and Smart Logistics Expo. This strategic co-location is not merely for scale; it reflects the deep, irreversible convergence of modern industries. Electronics and semiconductors are no longer siloed components but the foundational bedrock upon which automotive, manufacturing, and supply chain innovations are built.

At AUTOMOTIVE WORLD, attendees will see the latest in software-defined vehicles, electrification, and autonomous driving—all fields heavily reliant on the advanced sensors, processors, and power devices showcased at NEPCON. The synergy is direct and palpable: the next breakthrough in automotive safety or efficiency may well originate from a new packaging technology or sensor design discussed next door.

Meanwhile, Factory Innovation Week will explore the future of smart manufacturing, driven by AI-powered robotics and IoT systems. These "smart factories" are complex ecosystems of interconnected electronic devices, requiring the very manufacturing and packaging technologies that are the core of NEPCON's focus. Likewise, Smart Logistics Expo addresses the automation of supply chains, from AI-managed inventories to autonomous delivery robots, all powered by sophisticated electronic systems. This integrated platform allows professionals to see the full value chain, from the microscopic chiplet to the fully automated warehouse.

Charting a Course Through Global Tech Shifts

Beyond the exhibition halls, NEPCON JAPAN 2026 serves as a forum for addressing the tectonic shifts reshaping the global technology landscape. A key theme is the strategic realignment of the semiconductor supply chain. A much-anticipated address will be delivered by Dr. Rao R. Tummala, an advisor to the Indian Semiconductor Mission, on the "Emergence of Indian Semiconductor Industry for India and the World." His perspective offers a glimpse into how new players are entering the high-stakes world of chip manufacturing, diversifying a historically concentrated industry.

This focus on supply chain resilience is a direct response to recent global disruptions and geopolitical tensions. The event provides a crucial platform for companies to build new partnerships, diversify their sourcing, and explore localization strategies. At the same time, sustainability remains a powerful undercurrent. The Power Device & Module Expo, a key part of NEPCON, highlights innovations in energy-efficient semiconductors that are critical for reducing the carbon footprint of everything from data centers to electric vehicles.

As it celebrates four decades, NEPCON JAPAN is more than a retrospective. It stands as a forward-looking summit, bringing together the brightest minds and most influential companies to chart a course for the future. The technologies and collaborations forged here will undoubtedly shape the next era of innovation across the globe.