Fujifilm Bets Big on Advanced Materials for AI & Green Chips

SAN JOSE, CA – February 19, 2026 – As the global technology sector prepares for the next leap in artificial intelligence and computing power, Fujifilm is positioning itself as a critical enabler of that future. The company is set to unveil its latest research in advanced semiconductor materials at the prestigious SPIE Advanced Lithography + Patterning conference next week, showcasing innovations that lie at the heart of a bold strategy to double its semiconductor materials revenue to 500 billion yen (approximately $3.26 billion USD) by fiscal year 2030.

The presentations, scheduled to take place in San Jose, California, will go far beyond academic interest. They represent a strategic offensive into the most demanding and lucrative segments of the semiconductor market, including Extreme Ultraviolet (EUV) lithography, Nanoimprint Lithography (NIL), and environmentally sustainable PFAS-free materials. These technologies are not merely incremental improvements; they are foundational components required to manufacture the next generation of microchips that will power everything from advanced AI data centers to autonomous vehicles.

The Race for AI Supremacy and the Material Hurdle

The relentless demand for more powerful AI has created an engineering challenge of unprecedented scale. As chipmakers like Intel, NVIDIA, and TSMC push the boundaries of Moore’s Law, they are increasingly reliant on High-NA EUV lithography—a revolutionary technique that uses extremely short-wavelength light to etch unimaginably small circuits onto silicon wafers. These systems, developed by industry giant ASML at a cost of nearly $400 million per machine, are the printers of the 21st century. However, a printer is useless without the right ink.

This is where Fujifilm’s research becomes paramount. The “ink” in this analogy is the photoresist, a light-sensitive material coated onto the silicon wafer that records the intricate circuit pattern. As feature sizes shrink below 10 nanometers, the physical properties of this material become a primary bottleneck. High-NA EUV systems require thinner layers of photoresist, which can lead to pattern collapse, increased defects, and so-called stochastic effects—random errors that can render a multi-billion dollar chip useless.

At SPIE 2026, Fujifilm researchers will directly address these challenges. They plan to present findings on enhanced defect-reduction in negative-tone EUV resists and significant progress in developing next-generation photoresists compatible with high-NA EUV exposure. This work is crucial for achieving the high-precision patterning that state-of-the-art AI semiconductors demand. By refining the chemistry of these materials, Fujifilm aims to solve the core issues of roughness and defectivity that currently limit the full potential of High-NA EUV technology.

A ¥500 Billion Vision for Semiconductor Dominance

Fujifilm's focus on advanced materials is the cornerstone of an aggressive corporate strategy. The company has committed to investing approximately 170 billion yen in its semiconductor materials business between fiscal years 2024 and 2026—more than double its investment from the previous three years. This massive capital injection is designed to expand global production capacity and accelerate research and development, all in service of its goal to double revenue to 500 billion yen by 2030.

This ambition places Fujifilm in direct competition with established materials giants like Shin-Etsu Chemical and Merck KGaA. To stand out, the company is leveraging its “One-Stop Solution” philosophy, offering a comprehensive portfolio that extends far beyond photoresists to include CMP slurries for polishing, high-purity process chemicals, and post-CMP cleaners. This integrated approach allows chipmakers to source a wide array of critical materials from a single, trusted partner, streamlining complex supply chains.

“As a leading supplier of electronic materials to the global semiconductor industry, including AI semiconductors, the advanced resist market provides a unique opportunity for our company and our One-Stop Solution philosophy for customers,” said Tetsuya Iwasaki, a director and general manager of the Electronic Materials Business Division at FUJIFILM Corporation, in a statement ahead of the conference. “Our SPIE presentations will provide attendees with a greater understanding of our capabilities in this area.”

Charting a Greener Path for Chip Manufacturing

Beyond raw performance, the semiconductor industry faces mounting pressure to address its environmental impact. A key area of concern is the use of per- and polyfluoroalkyl substances (PFAS), a class of “forever chemicals” prized for their durability and chemical resistance but flagged by regulators for their persistence in the environment. With both the U.S. Environmental Protection Agency (EPA) and the European Chemicals Agency (ECHA) moving to restrict their use, the industry is in a race to find viable alternatives.

Fujifilm is positioning itself at the forefront of this green transition. One of its key presentations at SPIE will introduce a new lineup of PFAS-free positive tone ArF immersion resists. ArF lithography remains a workhorse for many critical layers in chip manufacturing, and developing a PFAS-free alternative that doesn’t compromise performance is a significant technical achievement. This initiative aligns with the company’s global “Sustainable Value Plan 2030” and represents a shrewd business move, offering chipmakers a path to de-risk their operations from future regulations and build more sustainable supply chains.

Exploring Alternative Roads to Miniaturization

While EUV lithography captures most of the headlines, Fujifilm is also investing in other promising technologies. The company will present new developments in UV-curable spin-coating resists for Nanoimprint Lithography (NIL). Unlike photolithography, which uses light to create patterns, NIL functions more like a high-precision stamp, pressing a patterned mold onto the resist to transfer the design.

This technology offers a potentially lower-cost, high-throughput alternative for certain manufacturing steps. By developing advanced materials for NIL, Fujifilm demonstrates a diversified innovation strategy, ensuring it has solutions ready for multiple next-generation manufacturing pathways. This broad-based approach reinforces its value proposition as a comprehensive materials science partner, capable of tackling the industry's challenges from multiple angles.

The research shared at SPIE 2026 will serve as a clear statement of intent. Fujifilm is no longer just a legacy imaging company; it is a critical technology powerhouse aiming to supply the fundamental building blocks of the digital world, directly influencing the trajectory of artificial intelligence and the sustainability of the entire semiconductor ecosystem.