Tower Semiconductor and NewPhotonics Launch High-Volume Shipments of AI-Optimized Optical Engine PICs
Event summary
- Tower Semiconductor and NewPhotonics began high-volume shipments of laser-integrated optical engine PICs for AI interconnects on September 17, 2026.
- The PICs support data rates from 800G to 1.6T, with future plans for 6.4T solutions in 1H27.
- The collaboration leverages Tower's PH18DA silicon photonics platform for monolithic laser integration.
- NewPhotonics' NPG102 PIC products for 800G and 1.6T are now in volume production.
The big picture
The partnership between Tower Semiconductor and NewPhotonics addresses the urgent need for high-bandwidth, energy-efficient optical interconnects in AI infrastructure. This collaboration leverages advanced silicon photonics technology to reduce complexity and improve manufacturing consistency, positioning the companies at the forefront of the AI interconnect market. The shift towards higher data rates and the integration of lasers into photonic circuits highlight the strategic importance of this development in the semiconductor industry.
What we're watching
- Technology Adoption
- How quickly OEMs and data centers will integrate these high-bandwidth, energy-efficient optical interconnects into their AI infrastructure.
- Market Competition
- Whether Tower Semiconductor and NewPhotonics can maintain their lead in the silicon photonics market against emerging competitors.
- Scalability
- The pace at which the companies can scale production to meet the growing demand for AI interconnect solutions.
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