Tower Semiconductor Launches Gen3 LDMOS Tech to Tackle AI Power Wall
Event summary
- Tower Semiconductor released its Gen3 BCD technology with industry-leading LDMOS performance for high-current applications.
- The technology targets the $2.5B Monolithic Smart Power Stage and DrMOS market, projected to grow to $4.7B by 2031.
- Tower will present at APEC 2026 (March 23–25) in San Antonio, TX, showcasing its power management platform for AI processors.
- Dr. Mete Erturk, Co-General Manager of Power Management BU, will present on March 24, 2026, at 3:45 PM.
The big picture
Tower Semiconductor's Gen3 LDMOS technology addresses the 'AI power wall,' a critical bottleneck in AI data center power delivery. The technology aims to improve efficiency and reduce heat generation, positioning Tower as a key player in the growing market for high-current applications. The $2.5B Monolithic Smart Power Stage and DrMOS market is projected to more than double by 2031, highlighting the strategic importance of Tower's advancements.
What we're watching
- Market Adoption
- How quickly Tower Semiconductor can secure design wins for its Gen3 LDMOS technology in the AI processor power delivery market.
- Competitive Positioning
- Whether Tower can sustain its leadership in BCD performance amid competition from other semiconductor foundries.
- Technological Integration
- The pace at which Tower integrates its silicon photonics leadership with advanced power management capabilities for AI infrastructure.
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