SK hynix and Sandisk Unveil HBF Standard Specifications at FMS 2026
Event summary
- SK hynix and Sandisk unveiled the first standard specifications for High Bandwidth Flash (HBF) technology at FMS 2026.
- The HBF consortium, launched in February 2026, now includes Google and Tenstorrent, accelerating ecosystem expansion.
- SK hynix introduced its tenth-generation (V10) 375-layer 4D NAND, offering a 2.5x increase in power efficiency.
- HBF technology bridges HBM and SSDs, providing scalable bandwidth (0.4TB/s to 3.0TB/s) and capacity (up to 512GB).
- The specifications were disclosed through the Open Compute Project (OCP), positioning HBF as an open industry standard.
The big picture
SK hynix's HBF standard addresses the growing memory bottlenecks in AI infrastructure, positioning itself as a key player in next-generation storage solutions. The rapid standardization and ecosystem expansion reflect the urgent need for scalable, high-bandwidth memory technologies in the era of Agentic AI.
What we're watching
- Ecosystem Adoption
- How quickly Google, Tenstorrent, and other partners integrate HBF into their AI infrastructure.
- Market Differentiation
- Whether SK hynix can sustain its leadership in AI NAND with the 375-layer 4D technology.
- Technical Maturity
- The pace at which HBF achieves widespread acceptance as an open standard in data centers.
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