SCHMID Unveils Any Layer ET Process for Advanced Packaging
Event summary
- SCHMID introduced the Any Layer ET (Embedded Trace) Process for full panel-level advanced packaging on April 30, 2026.
- The technology enables precise copper embedding within dielectric layers, improving line definition and electrical performance.
- SCHMID will showcase the technology at ECTC 2026 in Orlando, Florida, in May 2026.
The big picture
SCHMID's Any Layer ET Process addresses the growing complexity in substrate manufacturing driven by AI, high-performance computing, and heterogeneous integration. The technology aims to provide superior signal integrity, power delivery, and scalability for advanced packaging applications. As demand for ultra-fine line structures and high-density interconnects increases, SCHMID positions itself as a key enabler of next-generation semiconductor performance scaling.
What we're watching
- Technology Adoption
- How quickly semiconductor manufacturers will integrate the Any Layer ET Process into their production lines.
- Market Differentiation
- Whether SCHMID can maintain its competitive edge in advanced packaging solutions amid increasing demand for AI-driven compute architectures.
- Industry Collaboration
- The extent to which ECTC 2026 will facilitate partnerships and discussions on next-generation substrate manufacturing strategies.
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