ROHM Expands 600V Super Junction MOSFET Lineup with High-Thermal Surface-Mount Packages
Event summary
- ROHM Semiconductor launched new 600V Super Junction MOSFETs in surface-mount packages (DFN8080-5L and TOLL) for high-power-density applications.
- The lineup includes 21 models in the R60xxXNx series and 11 in the PrestoMOS™ R60xxWNx series, with mass production starting June 2026.
- Key features include 3V–5V gate threshold voltage compatibility, improved admittance characteristics, and support for multi-sourcing.
- Target applications span AI server power supplies, industrial equipment, and motor drives.
The big picture
ROHM’s expansion of its Super Junction MOSFET lineup targets the growing demand for energy-efficient, space-saving power solutions in data centers and industrial applications. The shift toward surface-mount packages aligns with broader industry trends toward miniaturization and thermal management, while multi-sourcing support addresses supply chain risks. The move positions ROHM to compete more aggressively in high-growth segments like AI infrastructure.
What we're watching
- Competitive Positioning
- Whether ROHM’s focus on multi-sourcing compatibility will strengthen its market share against competitors like Infineon or STMicroelectronics.
- Technological Roadmap
- The pace at which ROHM advances to 650V and next-generation MOSFETs, given the June 2026 launch timeline for these products.
- Industry Adoption
- How quickly AI server and industrial equipment manufacturers integrate these MOSFETs into high-power-density designs.
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