QuickLogic Advances Radiation-Hardened FPGA Push with Dev Kit Release
Event summary
- QuickLogic released a development kit for its RadPro FPGA, fabricated in the U.S. on GlobalFoundries’ 12nm process.
- The RadPro FPGA is designed to meet requirements for defense industrial base (DIB) programs.
- QuickLogic began accepting orders for the RadPro Dev Kit in Q1 2026, with shipments scheduled after the HEART Conference (April 13–17, 2026).
- The RadPro FPGA is silicon-proven, marking a milestone in QuickLogic's radiation-hardened FPGA initiative.
The big picture
QuickLogic's RadPro FPGA addresses a growing need for domestically sourced, radiation-hardened semiconductors within the U.S. defense industrial base, spurred by supply chain concerns and government mandates. The company’s focus on radiation hardening, combined with its eFPGA capabilities, positions it to capture a niche market segment within the broader semiconductor industry. Success hinges on securing and executing on DIB contracts, which are often subject to lengthy procurement processes and stringent performance requirements.
What we're watching
- Order Fulfillment
- The timing and volume of RadPro Dev Kit shipments following the HEART Conference will indicate initial DIB interest and potential for broader adoption.
- Program Integration
- The ability of QuickLogic to transition DIB evaluations into formal 'programs of record' will be crucial for long-term revenue generation and validates the strategic focus.
- Competitive Landscape
- How QuickLogic’s U.S.-fabricated, radiation-hardened FPGA offering differentiates from competitors in the DIB space will determine its market share and pricing power.
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