POET Technologies Targets AI Interconnects with High-Power Laser Showcase at CIOE 2026
Event summary
- POET Technologies will exhibit at CIOE 2026 from September 9-11, showcasing high-power laser light sources for AI interconnects.
- Dr. Mo Jinyu, SVP of Global Product Development, will present at IFOC on September 8 about laser light sources for AI/ML interconnects.
- CEO Dr. Suresh Venkatesan highlights progress in wafer-level chip-scale packaging for low-cost, high-power optical interconnects.
- CIOE expects 3,800 exhibitors and 240,000 professional visitors from 30+ countries.
The big picture
POET’s participation in CIOE 2026 underscores the growing demand for high-performance optical interconnects in AI-driven data centers. The company’s focus on wafer-level packaging aligns with industry trends toward miniaturization and power efficiency, but success will depend on execution in a competitive semiconductor landscape. The event serves as a critical platform for POET to validate its technology with global optoelectronics leaders.
What we're watching
- Market Adoption
- How POET’s wafer-level chip-scale packaging technology gains traction among hyperscale data center operators.
- Technical Validation
- Whether POET can demonstrate scalable, low-cost manufacturing of high-power optical interconnects.
- Competitive Positioning
- The pace at which POET differentiates itself in the crowded AI interconnects market.
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