onsemi Unveils Embedded Power Platform to Boost AI and EV Power Density — ON Semiconductor Corporation (onsemi)

Event summary

onsemi launched the Embedded Power Platform (EPP), a breakthrough architecture integrating multiple dies into a single silicon device, enabling 3–5x higher power density.
EPP combines electrical, mechanical, and thermal design optimization within a single architecture, reducing development complexity for AI and electrification applications.
Subaru Corporation is an early engagement partner, evaluating EPP for future electrified vehicle architectures.
EPP is expected to begin sampling in 2026 with strategic customers across automotive and AI applications.

The big picture

onsemi's Embedded Power Platform addresses a critical bottleneck in AI and EV systems: power delivery. By integrating power electronics, mechanical design, and thermal management into a single architecture, onsemi aims to reduce development time and improve system performance. This move positions onsemi as a key player in the evolving power management landscape, where efficiency and compact design are paramount.

What we're watching

Adoption Pace: How quickly strategic customers will integrate EPP into their AI and EV systems, and whether it can meet the promised 3–5x power density improvements.
Competitive Response: Whether competitors will develop similar integrated power solutions, potentially eroding onsemi's first-mover advantage.
Scalability: The pace at which onsemi can scale EPP production to meet growing demand from AI data centers and electric vehicle manufacturers.