Molex Introduces Multi-Channel Liquid Cooled Busbars to Address AI Data Center Thermal Challenges
Event summary
- Molex unveiled Multi-Channel Liquid Cooled Busbars at Computex 2026, designed to support AI data centers with currents up to 15,000 Amps, scaling to 25,000 Amps.
- The seven-channel architecture improves cooling efficiency by up to 20% compared to single-channel designs, reducing thermal stress and hot spots.
- Busbars are compatible with ORV3 and HPR standards, ensuring future-proof investment protection for hyperscalers.
- Molex will demonstrate real-time thermal mapping of the technology at Computex 2026.
The big picture
As AI workloads push rack power requirements toward 1 megawatt, traditional air-cooled infrastructure is reaching its limits. Molex's innovation extends liquid cooling into the power-distribution layer, addressing the 'AI Thermal Gap' and enabling stable electrical performance without increasing rack footprint. This strategic move positions Molex as a key player in the evolving data center cooling market, particularly as hyperscalers seek future-proof solutions for high-density AI deployments.
What we're watching
- Adoption Pace
- How quickly hyperscalers will integrate Molex's liquid-cooled busbars into next-generation AI data centers.
- Competitive Response
- Whether competitors will introduce similar multi-channel liquid cooling solutions to meet rising AI power demands.
- Scalability
- The pace at which Molex can scale production to meet the growing demand for high-current data center solutions.