Molex Launches 224Gbps Copper Connectivity for AI Data Centers
Event summary
- Molex launched Impress Co-Packaged Copper Solutions on February 17, 2026, supporting data rates up to 224Gbps PAM-4.
- The solution leverages Molex's NearStack OTS technology, with over one million units delivered to date.
- Impress features a compression-based, substrate connector and cable assembly for near-ASIC connectivity.
- Molex is developing the solution for future 336G and 448G applications.
The big picture
Molex's Impress solution addresses the growing demand for higher data rates in AI-driven data centers, where signal integrity and power efficiency are critical. The launch comes as the industry transitions from 1.6T to 3.2T networking, driven by generative AI and large language models. Molex's move underscores the strategic importance of near-ASIC connectivity in future-proofing data center architectures.
What we're watching
- Adoption Pace
- How quickly hyperscale data centers and AI workloads will integrate 224Gbps solutions into their architectures.
- Competitive Response
- Whether competitors will accelerate their own 224Gbps and higher-speed connectivity solutions.
- Technical Validation
- The success of Molex's development efforts to validate Impress for 336G and 448G applications.
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