Midea Building Technologies Launches Full-Stack Data Center Cooling for AI Era

  • Midea Building Technologies introduced a full-stack data center thermal management solution for AI infrastructure at its 'Feel the Future' event in Kuala Lumpur on May 22, 2026.
  • The solution includes three core products designed for tropical conditions: Maglev Active CDU, Next-Gen Air-Cooled Magnetic Bearing Chiller, and Industrial-Grade CDU.
  • Midea unveiled a RMB 1 billion liquid-cooling smart manufacturing base in Shunde, expected to start production in August 2027.
  • The company is collaborating with the National University of Singapore on sustainable data center cooling research.

As AI computing density continues to surge, traditional air cooling systems are struggling to keep up, particularly in hot and humid tropical environments. Midea Building Technologies is positioning itself as a key enabler of global AI computing infrastructure by offering end-to-end liquid cooling solutions. The company's strategic investments in manufacturing capacity and academic collaborations underscore its commitment to addressing the industry's pain points around energy efficiency and deployment speed.

Manufacturing Scale
The pace at which Midea's Shunde manufacturing base ramps up production will determine its ability to meet global AI data center cooling demand.
Technological Adoption
Whether Midea's full liquid-cooling matrix can gain traction in tropical markets where traditional air cooling has been dominant.
Industry Standards
How the shift from PUE to more comprehensive metrics like compute efficiency and total cost of ownership will impact Midea's competitive positioning.