MACOM Launches 3.2T Chipset for AI and Data Center Optical Links — MACOM Technology Solutions Holdings, Inc.

Event summary

MACOM introduced a 3.2T chipset solution for high-speed optical connectivity on September 17, 2026.
The solution supports eight channels operating at 448 Gbps PAM-4, targeting AI infrastructure and cloud data centers.
Key components include transimpedance amplifiers (TIAs) and photodiodes, paired with previously launched 448 Gbps PAM-4 drivers.
Products will be showcased at ECOC2026 in Málaga, Spain, from September 21 to 23, 2026.

The big picture

MACOM's 3.2T chipset solution is a strategic move to capture the growing demand for high-speed optical connectivity in AI and cloud data center applications. The solution simplifies development and accelerates time-to-market for customers, positioning MACOM as a key player in the evolving data center infrastructure landscape. The launch aligns with broader industry trends toward higher bandwidth and more efficient optical interconnects.

What we're watching

Market Adoption: How quickly data center operators and AI infrastructure providers integrate the 3.2T chipset into their architectures.
Competitive Positioning: Whether MACOM can maintain its lead in high-speed optical connectivity against competitors.
Technical Performance: The real-world performance of the 3.2T chipset in demanding optical link applications.