MACOM Unveils Hot Via Chip Scale Tech to Replace Wire Bonds — MACOM Technology Solutions Holdings, Inc.

Event summary

MACOM introduced a chip scale hot via process built on AlGaAs diode technology on June 8, 2026.
The technology eliminates wire bonds, simplifying surface mount assembly and improving high-frequency performance.
First product using the technology is the MASW-011261, a broadband SP2T switch operating from 60 to 110 GHz.
The MASW-011261 delivers 0.9 dB insertion loss, 30 dB isolation, and sub-20 ns switching speeds in a 1.87 mm x 1.98 mm package.
The technology will be showcased at the International Microwave Symposium (IMS 2026) in Boston from June 9 to 11, 2026.

The big picture

MACOM’s hot via technology addresses the growing demand for simplified assembly and high-performance components in the mmWave frequency range. This innovation aligns with broader industry trends toward miniaturization and integration in telecommunications and data center applications. The technology could enhance MACOM’s competitive edge in the semiconductor market, particularly in high-frequency applications.

What we're watching

Adoption Pace: How quickly customers will integrate MACOM’s hot via technology into their designs and manufacturing processes.
Performance Validation: Whether the technology can sustain its promised benefits across a broader range of applications and frequencies.
Competitive Response: The pace at which competitors will develop similar or alternative technologies to challenge MACOM’s position.