Intel and ASML Advance High NA EUV Production with Over 1 Million Wafers Processed
Event summary
- Intel Foundry and ASML have processed over 1 million wafers using High NA EUV lithography, meeting production expectations.
- High NA EUV is currently used in volume production for select layers of Intel's Panther Lake processors.
- Intel Foundry and ASML are collaborating to advance the adoption of larger-format masks for future High NA scaling.
- Intel Foundry has been a leader in High NA adoption, installing the first commercial EXE system in 2024.
- ASML and Intel Foundry will present updates on reticle stitching at the SPIE conference on September 8, 2026.
The big picture
Intel Foundry and ASML's collaboration on High NA EUV lithography is a strategic move to stay ahead in the semiconductor manufacturing industry. As AI-driven products become more complex, the need for advanced manufacturing technologies like High NA EUV becomes critical. The collaboration aims to drive standards, infrastructure, and technology advances needed to support future scaling, positioning both companies as leaders in the lithography ecosystem.
What we're watching
- Technology Adoption
- The pace at which High NA EUV lithography will be adopted by other semiconductor manufacturers.
- Industry Standards
- Whether the industry will align around the larger-format mask standards being championed by Intel Foundry and ASML.
- Execution Risk
- How Intel Foundry and ASML will manage the transition to 6x12-inch masks while maintaining current production capabilities.
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