DesignCon Honors Signal Integrity Pioneer and AI-Driven High-Speed Design Innovations
Event summary
- Bert Simonovich named 2026 DesignCon Engineer of the Year for contributions to signal integrity and PCB technology.
- Seven Best Paper Awards given for advancements in high-speed communications and AI-driven design.
- DesignCon 2027 scheduled for February 2-4, 2027, at the Santa Clara Convention Center.
- Awards recognize innovations in 400G/448G channels, PCIe 7.0 interconnects, and EMI mitigation.
The big picture
DesignCon's awards highlight the critical role of high-speed communications and AI-driven design in advancing semiconductor and electronics technologies. The event serves as a barometer for industry innovation, with a focus on scaling up AI applications and improving interconnect performance. Informa's Manufacturing division continues to solidify its position as a key facilitator of engineering knowledge exchange, connecting global leaders in chip, board, and systems design.
What we're watching
- AI-Driven Design
- How advancements in AI-driven high-speed channels will impact future semiconductor and electronics design.
- PCIe 7.0 Adoption
- The pace at which PCIe 7.0 interconnects will be commercialized and integrated into next-gen systems.
- Signal Integrity Standards
- Whether the Cannonball model and other signal integrity innovations will become industry standards.
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