HyperLight Corporation

HyperLight Corporation is a privately held company headquartered in Cambridge, Massachusetts, dedicated to advancing integrated photonics. The company's core mission is to build the integrated photonics platform of the future by leveraging the superior optical characteristics of thin-film lithium niobate (TFLN) through high-volume manufacturing processes. This approach aims to deliver unprecedented bandwidth and energy efficiency, enabling faster time-to-market in the rapidly evolving photonics landscape.

HyperLight's key offering is its proprietary, patented TFLN Chiplet™ platform, which uniquely combines thin-film lithium niobate with scalable CMOS-like fabrication techniques. Their product portfolio includes high-performance intensity modulation/direct detection (IMDD) transmitter PICs, dual-polarization IQ (DPIQ) transmitter PICs, and packaged modulators. The company provides a comprehensive suite of TFLN-based products and customized solutions, encompassing design, manufacturing, advanced testing, and seamless integration. These solutions cater to critical technologies across AI, data centers, telecommunications, quantum computing, and other emerging applications.

In June 2026, HyperLight Corporation closed an $80 million Series C funding round led by MediaTek, with participation from several strategic investors. This funding is intended to expand manufacturing capacity, accelerate customer qualification, and scale its TFLN Chiplet™ platform. The company, co-founded by CEO Mian Zhang and Head of Technology Development Kevin Luke, also announced a strategic manufacturing partnership with UMC and Wavetek for high-volume foundry production of its TFLN Chiplet™ Platform on both 6-inch and 8-inch wafers, solidifying its market positioning as a leader in high-performance integrated photonics for the AI era.