Heilind Expands Automotive Portfolio with Molex’s High-Speed HFM Connectors
Event summary
- Heilind Electronics added Molex’s High-Speed FAKRA-Mini (HFM®) Interconnect System to its portfolio on February 2, 2026.
- The HFM system supports up to 28 Gbps transmission and frequencies up to 20 GHz, with an 80% smaller footprint than standard FAKRA connectors.
- Designed for ADAS, autonomous driving, camera, and telematics applications, the system supports key automotive protocols like Ethernet and MIPI A-PHY.
- Features include integrated secondary locks, EMI shielding, and multiple keying options for error-free assembly.
The big picture
The addition of Molex’s HFM system to Heilind’s portfolio reflects the increasing demand for compact, high-speed connectivity solutions in modern vehicles. As automotive electronics become more complex, the need for reliable, space-efficient interconnects is critical for ADAS, autonomous driving, and telematics applications. Heilind’s move positions it as a key supplier in the evolving automotive electronics market.
What we're watching
- Adoption Pace
- How quickly automotive manufacturers will integrate the HFM system into next-generation vehicle designs.
- Competitive Response
- Whether competitors will introduce similar high-speed, miniaturized interconnect solutions.
- Scalability
- The extent to which Heilind can scale supply to meet growing demand for advanced automotive connectivity solutions.
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