GlobalFoundries and RAAAM Develop GCRAM Test Chip on FDX Platform
Event summary
- GlobalFoundries and RAAAM Memory Technologies have successfully taped out a GCRAM test chip on GF’s FDX platform.
- The collaboration aims to address on-chip memory bottlenecks in edge AI, automotive, and IoT devices.
- GCRAM technology achieves 40% memory area shrink and up to 60% power reduction compared to SRAM.
- Early customer access to GCRAM design is expected to begin in early 2027.
The big picture
The collaboration between GlobalFoundries and RAAAM addresses a critical bottleneck in on-chip memory, driven by the increasing data demands of edge AI and IoT devices. This development could redefine power-performance-area dynamics in semiconductor design, potentially setting a new standard for on-chip memory solutions. The involvement of NXP Semiconductors underscores the industry's recognition of the technology's potential.
What we're watching
- Adoption Pace
- How quickly lead customers will integrate GCRAM technology into their designs post-2027.
- Market Differentiation
- Whether GCRAM can sustain its competitive edge against alternative on-chip memory solutions.
- Scalability
- The pace at which GlobalFoundries can scale GCRAM production to meet growing demand.
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