GlobalFoundries Advances RF Packaging with SLATE on 9SW Platform
Event summary
- GlobalFoundries qualified its SLATE wafer-to-wafer bonding technology for production on the 9SW RF-SOI platform.
- The technology reduces die size by up to 45%, targeting space-constrained applications in smart mobile devices.
- Volume production is expected to begin in the second half of 2027, with prototyping available later this year.
- SLATE enables vertical integration of large FETs, improving efficiency and reducing RF board space.
The big picture
GlobalFoundries' move to qualify SLATE on its 9SW platform addresses the growing demand for compact, high-performance RF solutions in 5G and satellite communications. This advancement positions GF as a key player in advanced packaging, a critical area for semiconductor innovation as device miniaturization continues. The integration of SLATE with 9SW could reshape the competitive landscape for RF front-end modules, particularly as mobile and wireless applications evolve.
What we're watching
- Adoption Pace
- How quickly customers will integrate SLATE technology into next-generation 5G front-end modules.
- Competitive Response
- Whether competitors like TSMC or Samsung will accelerate their own advanced packaging solutions.
- Market Expansion
- The pace at which SLATE technology extends beyond mobile devices into data centers and IoT applications.
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