Dover’s CPC Launches High-Efficiency Cooling Connectors for AI Data Centers
Event summary
- CPC, a Dover subsidiary, launched the Everis DC Series full-flow connectors for AI cooling on July 22, 2026.
- The connectors reduce pressure drop by up to 90% compared to valved alternatives, improving energy efficiency.
- Designed for hyperscale data centers, they support compact server form factors and high-purity liquid cooling.
- CPC will showcase the product at the OCP APAC Summit in Taipei on August 11-12, 2026.
The big picture
As AI workloads drive up data center power densities, liquid cooling solutions are becoming critical infrastructure. Dover’s CPC is positioning itself as a key supplier with this launch, targeting energy efficiency gains that matter for hyperscale operators. The product aligns with broader industry shifts toward open-source data center designs, as evidenced by the OCP showcase.
What we're watching
- Adoption Pace
- How quickly hyperscale data centers integrate the Everis DC Series into their AI cooling systems.
- Competitive Response
- Whether rivals like LiquidCool Solutions or Asetek introduce comparable full-flow connector technologies.
- Next-Gen Compatibility
- The extent to which the connectors adapt to emerging thermal demands of advanced AI chips.
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