DG Matrix Doubles Interport Power to 400 kW with STMicroelectronics’ SiC Tech
Event summary
- DG Matrix doubled the power output of its Interport™ platform to 400 kW using STMicroelectronics’ silicon carbide (SiC) technology.
- The breakthrough maintains the same power module footprint, critical for high-density AI datacenters.
- STMicroelectronics has provided technical support and advanced SiC components, leveraging automotive field experience.
- SemiAnalysis projects 800 VDC architecture will underpin 39 GW of new datacenter capacity by 2030, creating a multi-billion-dollar opportunity for solid-state transformers.
The big picture
DG Matrix’s collaboration with STMicroelectronics underscores the critical role of silicon carbide technology in enabling higher power densities for AI datacenters. As GPU rack power densities surge past 600 kW and hyperscalers transition to 800 VDC distribution, solid-state transformers are becoming central to power infrastructure. The partnership leverages decades of industry and research experience, positioning DG Matrix to capitalize on the multi-billion-dollar opportunity projected by SemiAnalysis.
What we're watching
- Power Density Scaling
- How DG Matrix’s power density breakthrough will affect adoption in AI datacenters and electrification applications.
- Market Timing
- Whether DG Matrix can sustain its competitive position as the 800 VDC transition accelerates.
- Technological Integration
- The pace at which future generations of SiC technology will be integrated into DG Matrix’s product roadmap.
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