DEEPX and Hyundai Robotics Collaborate on AI Chip for Next-Gen Robots
Event summary
- DEEPX and Hyundai Motor Group Robotics LAB announced a strategic collaboration on April 21, 2026, to develop a next-generation Physical AI computing platform for robotics.
- The partnership focuses on co-developing AI computing architecture capable of running large-scale generative AI models in real time within robotic systems.
- DEEPX's DX-M2 AI chip, designed for ultra-low-power environments, is central to the collaboration.
- The Physical AI semiconductor market is projected to reach $123 billion by 2030, with robotics and humanoids as primary demand drivers.
The big picture
The partnership marks a shift from data center-centric AI models to Physical AI, where intelligence extends into real-world systems like robots and industrial equipment. This collaboration is part of a broader industry trend towards creating standardized computing platforms for robotics, similar to the semiconductor industry's evolution. The Physical AI semiconductor market's projected growth to $123 billion by 2030 underscores the strategic importance of this collaboration.
What we're watching
- Market Leadership
- Whether DEEPX can establish itself as a global leader in Physical AI computing platforms amid growing competition.
- Technological Integration
- The pace at which the DX-M2 chip and Physical AI platform will be integrated into Hyundai's robotic systems.
- Industry Standardization
- How the collaboration will influence the development of standardized computing platforms in the robotics sector.
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