Coherent Showcases Co-Packaged Optics Tech for AI Data Centers at OFC 2026
Event summary
- Coherent Corp. will demonstrate multiple co-packaged optics (CPO) technologies at OFC 2026 in Los Angeles.
- Demonstrations include a 6.4T socketed CPO based on silicon photonics, a multimode socketed CPO with high-speed VCSELs, and an InP modulator on silicon operating at 400G.
- Coherent highlights its expertise across indium phosphide lasers, silicon photonics, VCSELs, and advanced packaging to support evolving data center architectures.
The big picture
Coherent's demonstrations at OFC 2026 underscore the critical role of photonics in enabling high-performance computing and AI infrastructure. The company's ability to support multiple optical architectures positions it as a key player in the evolving data center market, where bandwidth demands are escalating rapidly.
What we're watching
- Technology Adoption
- How Coherent's CPO technologies will be integrated into next-generation data center architectures.
- Market Positioning
- Whether Coherent can sustain its leadership in photonics amid growing demand for AI-scale data center networks.
- Scalability Challenges
- The pace at which Coherent can scale its CPO solutions to meet the rapidly increasing bandwidth demands of AI infrastructure.