Coherent Launches High-Conductivity Cold Plates for AI Chip Cooling
Event summary
- Coherent introduced Thermadite™ 800 Liquid Cold Plates for AI accelerator cooling, offering thermal conductivity of 800W/(m⋅K), twice that of copper.
- The material reduces chip temperatures by over 15°C in high heat flux environments and is 60% less dense than copper.
- Thermadite integrates diamond into a SiC matrix for superior stability and cooling efficiency without warpage or stress issues.
- Coherent will showcase the product at SEMI-THERM Symposium & Exposition 2026 and OFC 2026.
The big picture
Coherent's launch addresses the critical need for advanced cooling solutions in high-performance computing, particularly for AI accelerators. As AI workloads grow more intensive, thermal management becomes a bottleneck, making innovations like Thermadite 800 strategic for data center operators and semiconductor manufacturers. The product leverages Coherent’s expertise in photonics and materials science to differentiate itself in the competitive cooling solutions market.
What we're watching
- Adoption Pace
- How quickly AI chip manufacturers will integrate Thermadite 800 into their cooling systems.
- Competitive Response
- Whether competitors will develop similar high-conductivity materials to challenge Coherent's offering.
- Cost Efficiency
- The impact of Thermadite 800 on overall cooling system operating costs for data centers.
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