Broadcom Unveils AI Networking Breakthroughs at OCP Summit

  • Broadcom will showcase Ethernet switches, NICs, PCIe components, and integrated optics at the 2026 OCP Global Summit from October 12–15 in San Jose.
  • Key innovations include Tomahawk® 6, Tomahawk Ultra, and Jericho 4 Ethernet switches, Thor Ultra 800G and Thor 2 400G AI Ethernet NICs, and third-generation TH6-Davisson Co-Packaged Optics (CPO).
  • Asad Khamisy, SVP and GM of Broadcom’s Core Switching Group, will deliver a keynote on October 12, 2026, discussing scaling AI infrastructure through open innovation.
  • Broadcom will partner with 15+ companies to showcase its latest solutions across the show floor.
  • The summit will feature 12 technical speaking sessions led by Broadcom experts, addressing critical challenges and breakthroughs in AI infrastructure.

Broadcom's latest networking innovations aim to meet the growing demands of AI infrastructure, emphasizing Ethernet as the foundation for sustainable growth. The company's focus on open collaboration through the OCP Global Summit highlights the importance of an open ecosystem in supporting rapid innovation in AI data center infrastructure. Broadcom's leadership in shaping the future of AI infrastructure is underscored by its partnerships with 15+ companies and its extensive technical speaking sessions at the summit.

Scalability Challenges
How Broadcom's innovations will address the exponential bandwidth demands of frontier AI models.
Open Collaboration
Whether the OCP Foundation's collaborative model can sustain rapid innovation in AI data center infrastructure.
Market Adoption
The pace at which hyperscalers and cloud providers will integrate Broadcom's networking solutions into their AI clusters.