Amtech Systems, Inc.

Amtech Systems, Inc. is a global supplier of equipment, consumables, and services for semiconductor device packaging, wafer production, and device fabrication. Incorporated in Arizona in October 1981, the company's mission is to enable AI semiconductor device packaging and advanced substrate fabrication, serving various industries within the power semiconductor market, including mobile, computing, industrial, automotive, telecom, and medical. Amtech Systems is headquartered in Tempe, Arizona, United States.

The company's diversified product portfolio includes advanced packaging and electronics assembly equipment for applications such as AI GPUs and advanced automotive electronics. Its consumables and solutions are crucial for fabricating semiconductor devices like silicon carbide (SiC) and silicon (Si) power devices, digital and analog devices, power electronic packages, and advanced semiconductor packages and electronic assemblies. Amtech Systems operates through two primary segments: Thermal Processing Solutions, which includes conveyorized reflow equipment and diffusion furnaces, and Semiconductor Fabrication Solutions, offering processing consumables, equipment, and services for wafer production, including chemical mechanical polishing (CMP), lapping, polishing, and wafer cleaning. Products are recognized under leading brand names such as BTU International, Bruce Technologies, PR Hoffman, Entrepix, and Intersurface Dynamics.

In recent leadership changes, Guy Shechter was appointed President and Chief Executive Officer, effective August 13, 2026, with Bob Daigle transitioning to the role of Executive Chairman. Thomas Sabol was also appointed Principal Accounting Officer and Principal Financial Officer in May 2026. Amtech Systems is strategically positioned in high-growth sectors, particularly leveraged to AI-related advanced packaging and focusing on Silicon Carbide and Power Semiconductors. The company was added to the Russell 3000® and Russell 2000® Indexes on June 11, 2026, and successfully closed a $60 million oversubscribed public offering of common stock on June 3, 2026.