Alpha and Omega Semiconductor Launches High-Voltage MOSFETs for AI Server Power Demands

  • AOS introduced AONC40202 (25V) and AONC68816 (80V) MOSFETs in DFN 3.3x3.3 double-sided cooling packaging.
  • New MOSFETs feature optimized top-clip design for improved thermal management, with Rthc-top(max) of 0.9°C/W.
  • AONC40202 supports up to 405A continuous current and 175°C max junction temperature.
  • Products available immediately with lead times of 14-16 weeks; unit prices at $1.85 and $1.95 for 1,000-piece quantities.

AOS's new MOSFETs address the critical power density and thermal management challenges in AI servers, reflecting broader industry trends toward higher-performance data center components. The double-sided cooling technology represents a significant advancement over traditional packaging solutions, potentially setting a new standard for power efficiency in next-generation computing infrastructure.

Market Adoption
How quickly AI server manufacturers will integrate these MOSFETs into their designs.
Competitive Response
Whether competitors will match or surpass this thermal performance in future products.
Supply Chain Dynamics
The pace at which AOS can scale production to meet growing AI infrastructure demands.