Alchip Technologies Pushes 2nm ASIC Designs and Advanced Packaging at AI Infra Summit
Event summary
- Alchip showcasing 3nm ASIC designs in production and 2nm designs in development at AI Infra Summit 2026.
- Company highlights 3DIC ecosystem readiness and experience with multiple TSMC CoWoS® technologies.
- Alchip has completed over 650 tape-outs, with 10-20 new tape-outs annually.
- Focus on AI, high-performance computing, networking, and automotive applications.
The big picture
Alchip's showcase at AI Infra Summit underscores the accelerating race toward sub-3nm ASIC designs and advanced packaging solutions. The company's focus on AI and high-performance computing aligns with the industry's shift toward more specialized, high-bandwidth semiconductor solutions. With over 650 successful tape-outs, Alchip is positioning itself as a key player in the next generation of semiconductor innovation.
What we're watching
- Technology Leadership
- Whether Alchip can maintain its edge in advanced node ASIC designs amid intense competition.
- Packaging Innovation
- The pace at which Alchip's 3DIC and co-packaged optics technologies gain market adoption.
- Industry Collaboration
- How Alchip's partnership with TSMC evolves as both companies push boundaries in semiconductor manufacturing.
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