ACM Research Secures First Production Order for Ultra ECP ap-p Panel Electroplating Tool — ACM Research, Inc.

Event summary

ACM Research received its first production order for a 510 × 515 mm Ultra ECP ap-p tool from an existing advanced packaging customer in mainland China, with delivery scheduled for H1 2027.
The company also secured an evaluation order for a 310 × 310 mm Ultra ECP ap-p tool from a new leading panel-manufacturer customer based in Asia, with delivery set for Q4 2026.
The Ultra ECP ap-p is positioned as the world’s first commercial horizontal panel-level copper deposition system for large panel markets.
The tool supports plating processes across pillar, bump, and redistribution layer (RDL) applications.

The big picture

ACM Research’s Ultra ECP ap-p tool represents a strategic push into the growing large-panel electroplating market, where demand for uniformity and efficiency is rising. The orders signal early validation of ACM’s proprietary horizontal plating technology, positioning it as a key player in advanced semiconductor packaging. Success here could expand its customer base and reinforce its role in high-integration manufacturing processes.

What we're watching

Market Adoption: Whether ACM can sustain momentum in securing additional production orders beyond the initial customer.
Technical Validation: How the evaluation order from the new panel-manufacturer customer will influence future adoption rates.
Competitive Positioning: The pace at which ACM can solidify its leadership in the panel-level advanced packaging equipment market.