ACM Research Expands Ultra C Tahoe into Multi-Process Wet Platform
Event summary
- ACM Research expanded its Ultra C Tahoe system into a multi-process wet processing platform on August 7, 2026.
- The platform integrates batch and single wafer processes, supporting advanced wet processing applications for logic and memory device manufacturing.
- New process capabilities include uniform silicon nitride recess etching, polysilicon etching, tungsten recess processing, and silicon-germanium recess etching.
- The platform reduces sulfuric acid consumption by up to 75%, lowering manufacturing costs and chemical waste.
The big picture
ACM Research's expansion of the Ultra C Tahoe platform aligns with the growing complexity and sustainability demands in semiconductor manufacturing. The integration of multiple processes into a single hybrid platform addresses productivity and flexibility needs, positioning ACM to capitalize on the increasing demand for advanced wet processing solutions. This strategic move underscores the importance of consolidating process steps to reduce cycle times and enhance particle removal performance.
What we're watching
- Adoption Pace
- How quickly leading semiconductor manufacturers will adopt the expanded Ultra C Tahoe platform.
- Cost Efficiency
- Whether the platform's cost and environmental benefits will drive further demand in high-volume manufacturing.
- Technological Scalability
- The pace at which ACM can integrate additional advanced wet processing applications into the platform.
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