India-Israel Tech Bridge Forges New Path in Chip Design

TEL AVIV, Israel – November 27, 2025 – In a move that underscores a significant shift in the global semiconductor supply chain, Indian VLSI design services firm SignOff Semiconductors has officially launched a sales office in Tel Aviv. While the opening of a regional office might seem routine, this expansion, facilitated through a strategic partnership with local representation firm MosaIC Ltd., is a telling indicator of a much larger trend: the formation of a powerful technology corridor between India's deep engineering talent pool and Israel's world-renowned innovation ecosystem. This alliance is not just about market access; it's about creating a new, agile model for developing the next generation of complex silicon.

A Strategic Foothold in 'Silicon Wadi'

SignOff Semiconductors' entry into Israel is far more calculated than a simple geographic expansion. The Bangalore-based firm, which has grown to over 270 employees and reported revenues of approximately $4.63 million USD, is a specialized "boutique" design house. Its expertise lies in the highly complex, end-to-end process of taking a chip from initial specification to the final GDSII file ready for fabrication, with a proven track record of over 250 successful tape-outs.

Crucially, the company has cultivated expertise in the industry's most advanced manufacturing nodes, including TSMC's 3nm and processes down to 2nm. This specific capability directly addresses the needs of Israel's hyper-competitive tech landscape, often called 'Silicon Wadi.' The partnership with MosaIC Ltd., led by industry veteran Gary Golembo, provides an immediate and integrated channel into this ecosystem. MosaIC will not just sell services; it will embed SignOff's capabilities within Israel's network of fabless startups, scale-ups, and the massive R&D centers of global tech giants.

Rakesh Trivedi, Chief Strategy Officer & Growth Head of SignOff Semiconductors, framed the move as a strategic imperative. "Israel is a global leader in chip innovation, hosting some of the most advanced design centers and startups driving AI, HPC, automotive, networking, and security silicon," he stated. "We believe that combining Israel's design excellence with India's deep engineering and execution capability creates a powerful collaboration opportunity." This sentiment was echoed by Gary Golembo, GM of MosaIC, who noted that SignOff's "proven expertise... complements the needs of the Israeli semiconductor ecosystem perfectly."

Fueling Israel's High-Stakes Innovation Engine

Israel's semiconductor market, projected to grow from $5.08 billion in 2025 to over $7 billion by 2030, is defined by relentless, high-stakes innovation. It is home to the design centers of nearly every major global tech player—Intel, Nvidia, Amazon, Apple, and Google—all of whom are developing their most critical next-generation technologies here. Intel's Gaudi AI processors and Amazon's Graviton CPUs are just two examples of Israeli-led engineering shaping the future of computing.

This environment creates immense pressure for speed and expertise. Startups like AI chip developer Hailo and LiDAR sensor maker Innoviz must compete with multinational giants for talent and resources. This is precisely the gap that specialized design partners like SignOff aim to fill. By offering flexible engagement models—from full turnkey projects to augmenting existing teams—they provide a critical service that allows local companies to accelerate development without the massive overhead of hiring large, permanent in-house teams for every project phase.

The demand is particularly acute in areas like physical design and Design for Test (DFT) on advanced nodes, where the complexity and cost of errors are astronomical. SignOff's experience with 2nm and 3nm processes provides a vital capability for Israeli firms working on the bleeding edge of AI accelerators and high-performance computing chips, where power efficiency and performance are paramount. This partnership allows Israeli innovators to focus on their core competency—novel architectures and algorithms—while leveraging a proven partner for the arduous and highly specialized execution phase of chip design.

The India-Israel Semiconductor Corridor Takes Shape

The SignOff-MosaIC alliance is a powerful illustration of the burgeoning 'Israel-India Semiconductor Corridor,' a strategic relationship built on complementary strengths. For years, policymakers from both nations have worked to deepen ties beyond traditional trade, focusing on high-technology collaboration. Initiatives like the India-Israel Industrial R&D and Innovation Fund and recent Memorandums of Understanding on high-technology research have laid the groundwork for precisely this type of private-sector partnership.

This corridor thrives on a simple but effective value proposition: it pairs Israeli R&D and design ingenuity with India's vast and highly skilled engineering workforce. India is home to an estimated one-fifth of the world's semiconductor design engineers, providing a scale and depth of talent that is difficult to replicate. As chip designs become exponentially more complex, the need for large, coordinated teams to handle verification, implementation, and signoff becomes a critical bottleneck.

This trend is gaining momentum. In late 2024, Indian firm Blue Cloud Softech announced a $150 million agreement with an Israeli partner to co-develop edge-AI chips. Furthermore, reports continue to circulate about a potential $8 billion investment by Israel's Tower Semiconductor to establish a fabrication facility in India, supported by India's ambitious Semiconductor Mission. These moves, combined with SignOff's expansion, signal a maturation of the relationship from government-level agreements to tangible, industry-level integration. It represents a new, distributed model of global innovation where intellectual property can be conceived in Tel Aviv and physically implemented in Bangalore, shortening time-to-market for critical technologies.

Boutique Giants and the New Industrial Landscape

SignOff's global strategy—with recent expansions into Malaysia and Canada alongside its new Israeli presence—highlights the evolving structure of the semiconductor industry. The era of monolithic, vertically integrated giants is being complemented by a dynamic ecosystem of specialized, nimble service providers. These 'boutique' firms are becoming giants in their own right, not through sheer size, but through the depth of their expertise in niche, high-value domains.

In Israel, SignOff will enter a competitive field with established players like Avnet ASIC Israel (AAI), which has a long history of turnkey design. However, the sheer scale of demand within Israel's innovation-driven market, which is seeing a shift towards capital-intensive, stable growth after a period of rapid expansion, creates room for multiple specialized partners. The key differentiator is often not just capability, but the flexibility of the business model and a deep understanding of the client's specific technological challenges.

By focusing on services from SPEC to GDS2, SignOff is carving out a critical space in the value chain. This allows Israeli companies to de-risk their projects and manage costs more effectively. For the broader industrial landscape, this trend signifies a move toward more resilient and distributed supply chains. Rather than relying on a single region or a handful of large companies, the industry is building a global network of excellence, connecting innovation hubs like Tel Aviv with execution powerhouses like Bangalore. This collaborative model is not just transforming how chips are made; it is fundamentally accelerating the pace of industrial innovation itself.