Fabric8Labs Secures $50M to Revolutionize Electronics Manufacturing with Atomic-Level 3D Printing

SAN FRANCISCO, CA – November 13, 2025 – Fabric8Labs, a pioneer in additive manufacturing, today announced the successful completion of a $50 million Series A funding round. Led by New Enterprise Associates (NEA) and Intel Capital, the investment will fuel the company’s mission to revolutionize electronics manufacturing with its groundbreaking Electrochemical Additive Manufacturing (ECAM) technology.

ECAM represents a paradigm shift in metal 3D printing, offering unprecedented precision, material purity, and scalability. Unlike traditional powder-based methods, Fabric8Labs utilizes a room-temperature, water-based process to build parts at an atomic level. This innovative approach unlocks possibilities for high-performance components critical for rapidly evolving industries like artificial intelligence, high-performance computing, and advanced RF electronics.

Disrupting Traditional Manufacturing

For decades, electronics manufacturing has relied on subtractive processes and complex tooling, often resulting in material waste and design limitations. Additive manufacturing, or 3D printing, promised to overcome these challenges, but existing metal 3D printing technologies often fall short in terms of precision, material properties, and cost-effectiveness.

“The biggest challenge with existing metal 3D printing is that it often requires extensive post-processing to achieve desired material properties and surface finishes,” explains an industry analyst familiar with the technology. “Fabric8Labs' ECAM process seems to bypass many of these limitations, creating fully dense parts with exceptional quality directly from the printer.”

ECAM’s key differentiators include its ability to print with high-purity metals, such as copper and nickel, at room temperature. This eliminates thermal stresses, minimizes material waste, and enables the creation of intricate geometries previously impossible to achieve. The technology’s innovative micro-electrode array printhead, consisting of millions of individually addressable pixels, allows for atomic-level control over the building process.

Addressing the Thermal Challenge in AI & HPC

One of the most pressing challenges facing the AI and high-performance computing (HPC) industries is thermal management. As processors become more powerful and densely packed, they generate an immense amount of heat, requiring increasingly sophisticated cooling solutions. Traditional air cooling is reaching its limits, and liquid cooling systems are becoming essential for maintaining system performance and reliability.

“The demand for efficient thermal management solutions is skyrocketing,” says a data center engineer familiar with the technology. “Liquid cooling is the way forward, but it requires innovative components that can effectively dissipate heat and integrate seamlessly into existing systems.”

Fabric8Labs is directly addressing this challenge with its advanced ECAM-printed cold plates and heat spreaders. These components are designed to maximize heat transfer and optimize cooling performance in demanding AI and HPC applications. The company is collaborating with leading data center infrastructure providers, such as Wiwynn and AEWIN, to integrate its technology into next-generation cooling systems.

“We’re seeing a clear trend towards more sustainable and efficient data center operations,” notes an industry expert. “ECAM’s low energy consumption and reduced greenhouse gas emissions make it an attractive solution for companies looking to minimize their environmental impact.”

Beyond Thermal Management: Expanding Applications

While thermal management is a primary focus, Fabric8Labs’ ECAM technology has applications far beyond data centers. The company is also targeting the RF electronics market, where high-precision components are essential for enabling 5G, satellite communications, and other advanced wireless technologies.

“The ability to print with high-conductivity materials and create complex geometries is a game-changer for RF design,” explains an RF engineer. “ECAM could enable the development of smaller, more efficient, and higher-performing antennas, filters, and other critical components.”

Furthermore, ECAM’s ability to directly print onto temperature-sensitive substrates opens up possibilities for creating integrated circuits, sensors, and other advanced electronic devices. The company is exploring partnerships with companies in the automotive, aerospace, and medical device industries to develop innovative applications for its technology.

Strategic Investors Back Innovation

The $50 million funding round includes participation from strategic investors like SK hynix and Ericsson Ventures, signaling confidence in Fabric8Labs’ long-term potential. These investors bring not only capital but also industry expertise and access to potential customers and partners.

“The fact that SK hynix and Ericsson Ventures are investing in Fabric8Labs speaks volumes,” notes an industry analyst. “These are companies that are at the forefront of technological innovation, and they clearly see the value of ECAM in addressing critical challenges in their respective markets.”

Fabric8Labs plans to use the new funding to scale its manufacturing capacity, expand its engineering team, and accelerate the development of new applications for its technology. The company aims to become a leading provider of advanced manufacturing solutions for the electronics industry, enabling its customers to create innovative products and push the boundaries of what’s possible.

“We’re on a mission to revolutionize electronics manufacturing,” says a Fabric8Labs spokesperson. “With our innovative ECAM technology and the support of our strategic investors, we’re confident that we can deliver on that promise.”

About Fabric8Labs:

Fabric8Labs is a San Francisco-based additive manufacturing company pioneering a new era of electronics manufacturing with its innovative Electrochemical Additive Manufacturing (ECAM) technology.

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