Ceva & IntelPro Team Up to Power Next-Gen AIoT Devices with New Chipset

San Jose, CA – November 13, 2025 – Ceva, Inc. and IntelPro today announced a collaborative effort to deliver a new System-on-Chip (SoC) – the IPRO7AI – targeted at the rapidly expanding market for smart home, industrial, and consumer Internet of Things (IoT) devices. The IPRO7AI integrates Ceva’s wireless connectivity IPs, including Bluetooth Low Energy 5, alongside a RISC-V security MCU, image processing capabilities, and a dedicated Neural Processing Unit (NPU) for on-device artificial intelligence. This partnership addresses a critical need for low-power, secure, and interoperable AIoT solutions, while also embracing the Matter smart home standard.

Convergence of Connectivity & Intelligence

The announcement comes at a time when the IoT landscape is becoming increasingly complex. Consumers demand seamless interoperability, while businesses require robust security and efficient data processing at the edge. “The demand for intelligent devices that can operate autonomously and securely is skyrocketing,” says one industry analyst. “The key is to bring processing closer to the source of data, reducing latency and improving privacy.”

The IPRO7AI aims to meet these demands by combining Ceva’s proven expertise in wireless connectivity with IntelPro’s SoC design capabilities. “Connectivity and intelligence are truly converging in every corner of the IoT,” explains a source familiar with the collaboration. “By leveraging Ceva's market-leading wireless connectivity IPs, IntelPro can deliver turnkey connected AIoT platforms to its customers.”

Matter Integration & Interoperability

A crucial aspect of the IPRO7AI is its support for Matter, the industry-unifying application layer connectivity standard. Matter aims to simplify the smart home experience by ensuring interoperability between devices from different manufacturers. This support is increasingly vital as consumers become frustrated with the walled-garden approach of many smart home ecosystems.

“The biggest pain point for consumers is getting devices from different brands to actually work together,” says another industry insider. “Matter is a game-changer, and incorporating it into the IPRO7AI is a smart move for both companies.” By embracing Matter, the IPRO7AI aims to streamline device integration and provide a more seamless user experience.

Powering the Edge with AI

The integration of a dedicated NPU is a key differentiator for the IPRO7AI. On-device AI processing offers several advantages over cloud-based AI, including reduced latency, enhanced privacy, and lower power consumption. “Moving AI processing to the edge is essential for many applications,” states an AI specialist. “It allows devices to respond in real-time, without relying on a constant connection to the cloud.”

The NPU allows the IPRO7AI to perform tasks such as image recognition, voice control, and anomaly detection directly on the device, enabling a more responsive and secure experience. This is particularly important for applications in industrial automation, where real-time decision-making is critical.

Competitive Landscape & Market Opportunity

The market for IoT SoCs is highly competitive, with major players like Qualcomm, MediaTek, NXP, and Espressif vying for market share. However, the IPRO7AI aims to differentiate itself by offering a comprehensive solution that combines connectivity, security, and AI processing.

“There’s a lot of noise in the IoT SoC market, but very few companies are offering a complete package,” says a market analyst. “The IPRO7AI has the potential to stand out by addressing all of the key requirements for next-generation IoT devices.”

The global IoT market is projected to reach trillions of dollars in the coming years, driven by the increasing adoption of connected devices in various industries. The smart home segment is expected to be a major growth driver, followed by industrial automation, healthcare, and automotive. This partnership is well-positioned to capitalize on these trends.

A New Collaboration

While Ceva is a well-established IP licensor, the IPRO7AI marks a new collaboration with IntelPro. “This is the first product in IntelPro’s roadmap to be powered by Ceva’s wireless connectivity platforms,” a source close to the development reveals. “This partnership signifies a strategic alignment between the two companies, and future products are expected to expand to include Ceva's Wi-Fi 6 and dual-mode Bluetooth 5 solutions.”

This isn’t simply an IP licensing deal; it’s the start of a product line powered by Ceva’s technologies. It opens the door for IntelPro to develop a robust portfolio of AIoT solutions based on a proven foundation of connectivity and processing capabilities.

Looking Ahead

The IPRO7AI is poised to address a critical need in the rapidly evolving IoT landscape. By combining Ceva’s expertise in wireless connectivity with IntelPro’s SoC design capabilities, the companies have created a compelling solution that delivers performance, security, and interoperability.

“The future of IoT is all about intelligent devices that can seamlessly connect and interact with the world around them,” states a technology leader. “The IPRO7AI is a step in the right direction, and it has the potential to play a significant role in shaping the future of connected devices.” The chipsets are currently undergoing final testing and are expected to be available to manufacturers in early 2026, with broader availability anticipated later that year.