Centamil Unveils 5,000W Cooler to Solve AI's Overheating Crisis

ABU DHABI, UAE – May 28, 2026 – As the artificial intelligence industry races toward unprecedented computational power, it faces a fundamental physical limit: heat. Today, deep-tech firm Centamil announced a potential breakthrough with the launch of its first product, the Hayagreeva HEx, a direct-to-chip cold plate validated to remove over 5,000 watts of continuous heat, a figure that far surpasses the capacity of most current cooling solutions.

The announcement comes at a critical time for data center operators and AI hardware manufacturers. The powerful accelerator chips from giants like NVIDIA, AMD, and Intel that fuel the AI revolution are becoming exponentially more power-hungry, and therefore, hotter. This escalating thermal challenge threatens to throttle the very progress it enables.

Centamil, an intellectual property company founded by polymath inventor Praveen Kumar Gorakavi, aims to solve this problem head-on. The Hayagreeva HEx is engineered specifically for the next generation of AI silicon, which is projected to leave current cooling technologies far behind.

The AI Industry's Looming Heat Problem

The core of the issue lies in the rapid evolution of AI accelerators. Just three years ago, a top-tier chip dissipated around 300W of power. Today, that figure has quadrupled to 1,200W, and industry roadmaps project a leap to over 4,400W within the next 24 months. This surge in power density means that a single server rack filled with these accelerators can generate over 100kW of heat, an amount that traditional air-cooling systems are simply not equipped to handle efficiently or sustainably.

This thermal bottleneck has become one of the most significant challenges in data center design. Inefficient cooling leads to performance degradation, increased hardware failure rates, and staggering energy consumption—in some cases, more energy is spent on cooling than on computation itself. The global data center liquid cooling market, largely driven by AI's demands, is now projected to explode from approximately $5 billion in 2024 to over $48 billion by 2034, underscoring the urgency of the problem.

"AI silicon has been growing faster than the cooling sitting on top of it," said Praveen Kumar Gorakavi, Founder & CEO of Centamil, in the company's official announcement. "We built Hayagreeva HEx for the silicon that's about to ship."

A Breakthrough in Thermal Management

Centamil's Hayagreeva HEx addresses this challenge with a novel design. The direct-to-chip cold plate is built around a complex internal structure described as a "4,000+ m²/m³ copper-matrix wetted-surface architecture." In simpler terms, it uses an intricate, dense network of copper within the plate to create an enormous surface area for the liquid coolant to absorb heat directly from the chip.

This architecture results in exceptional thermal performance. The company reports a validated continuous heat removal capacity of over 5,000 watts with a rated thermal resistance of 0.005 °C/W—a key metric indicating highly efficient heat transfer. This provides the crucial "thermal headroom" needed not just for today's most powerful chips, but for the even more demanding generations set to arrive in the near future.

"Five thousand watts is what we validated; the architecture has more headroom beyond that," Gorakavi added, signaling the technology's future-proof design. The intellectual property behind the cold plate's thermal architecture, manufacturing process, and system integration is protected by 14 patent filings, highlighting the company's deep-tech focus.

The Polymath Inventor Behind the Innovation

Behind Centamil's technological solution is its founder, Praveen Kumar Gorakavi, whose background is as diverse as it is impressive. A former child prodigy, Gorakavi has a track record of inventing and commercializing over 28 technologies across disparate fields including chemical engineering, materials science, healthcare, and defense.

His accolades include being named to the Forbes Asia 30 Under 30 list in 2019 and receiving the prestigious Presidential Award (Balshree) from former Indian President APJ Abdul Kalam. His previous inventions range from a low-cost artificial limb and a 40,000-year calendar to advanced chemical additives that make paper lighter and more cost-effective. This history of cross-disciplinary problem-solving provides a unique foundation for tackling the multifaceted challenges of AI infrastructure.

Gorakavi's transition into AI thermal management applies his expertise in materials science and chemical engineering to one of the digital world's most pressing physical problems, lending significant credibility to Centamil's ambitious claims.

Navigating a Red-Hot Market

Centamil is entering a competitive and rapidly expanding market. Established players like Vertiv, CoolIT Systems, and Asetek are also racing to provide advanced liquid cooling solutions for the AI gold rush. However, Centamil is positioning itself not just as a hardware manufacturer, but as a deep-tech intellectual property company focused on developing and licensing next-generation technologies.

The company is moving quickly to get its innovation into the hands of key industry players. According to Sridhar Rao Julapally, the company's COO, Centamil is ready to deliver. "We've moved from validation to delivery: production samples ship within four to six weeks of an executed LOI," he stated. A pilot evaluation program is now open to qualified data center operators, server OEMs, and integration partners.

This strategy allows Centamil to partner with, rather than directly compete against, the large-scale manufacturers that build and deploy data center infrastructure. By focusing on licensing its core IP, the company aims to embed its technology across the ecosystem.

The launch of Hayagreeva HEx represents more than just a new product; it is a critical piece of enabling infrastructure. As the quest for more powerful AI continues, the physical constraints of power and heat will increasingly dictate the pace of innovation. Solutions that can effectively and efficiently manage this thermal load are no longer a niche requirement but a fundamental necessity for the future of computing.